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SN74AUC2G66DCTRG4 PDF预览

SN74AUC2G66DCTRG4

更新时间: 2024-11-16 15:52:11
品牌 Logo 应用领域
德州仪器 - TI 光电二极管
页数 文件大小 规格书
21页 873K
描述
DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8, GREEN, PLASTIC, SSOP-8

SN74AUC2G66DCTRG4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:LSSOP, TSSOP8,.16针数:8
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.7模拟集成电路 - 其他类型:SPST
JESD-30 代码:R-PDSO-G8JESD-609代码:e4
长度:2.95 mm湿度敏感等级:1
正常位置:NO信道数量:1
功能数量:2端子数量:8
标称断态隔离度:50 dB通态电阻匹配规范:3 Ω
最大通态电阻 (Ron):40 Ω最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:LSSOP封装等效代码:TSSOP8,.16
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260电源:1.2/2.5 V
认证状态:Not Qualified座面最大高度:1.3 mm
子类别:Multiplexer or Switches最大供电电压 (Vsup):2.7 V
最小供电电压 (Vsup):0.8 V标称供电电压 (Vsup):1.1 V
表面贴装:YES最长断开时间:4 ns
最长接通时间:3 ns技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:2.8 mmBase Number Matches:1

SN74AUC2G66DCTRG4 数据手册

 浏览型号SN74AUC2G66DCTRG4的Datasheet PDF文件第2页浏览型号SN74AUC2G66DCTRG4的Datasheet PDF文件第3页浏览型号SN74AUC2G66DCTRG4的Datasheet PDF文件第4页浏览型号SN74AUC2G66DCTRG4的Datasheet PDF文件第5页浏览型号SN74AUC2G66DCTRG4的Datasheet PDF文件第6页浏览型号SN74AUC2G66DCTRG4的Datasheet PDF文件第7页 
SN74AUC2G66  
DUAL BILATERAL ANALOG SWITCH  
www.ti.com  
SCES507ANOVEMBER 2003REVISED JANUARY 2007  
FEATURES  
DCT OR DCU PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoFree™ Package  
1A  
1B  
2C  
V
CC  
1
2
3
4
8
7
6
5
Operates at 0.8 V to 2.7 V  
Sub-1-V Operable  
1C  
2B  
2A  
Max tpd of 0.5 ns at 1.8 V  
GND  
Low Power Consumption, 10 µA at 2.7 V  
High On-Off Output Voltage Ratio  
High Degree of Linearity  
YZP PACKAGE  
(BOTTOM VIEW)  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
4
3
2
1
5
6
7
8
GND  
2C  
2A  
2B  
1C  
V
ESD Performance Tested Per JESD 22  
1B  
1A  
2000-V Human-Body Model  
(A114-B, Class II)  
CC  
200-V Machine Model (A115-A)  
1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This dual analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.1-V to 2.7-V VCC  
operation.  
The SN74AUC2G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 2.7-V  
(peak) to be transmitted in either direction.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000  
SN74AUC2G66YZPR  
_ _ _U6_  
–40°C to 85°C  
Reel of 3000  
Reel of 3000  
SN74AUC2G66DCTR  
SN74AUC2G66DCUR  
U66_ _ _  
U66_  
VSSOP – DCU  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
FUNCTION TABLE  
CONTROL  
INPUT  
(C)  
SWITCH  
L
OFF  
ON  
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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