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SN74AUC2G32_09 PDF预览

SN74AUC2G32_09

更新时间: 2024-11-16 11:53:19
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德州仪器 - TI 输入元件
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13页 528K
描述
DUAL 2-INPUT POSITIVE-OR GATE

SN74AUC2G32_09 数据手册

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SN74AUC2G32  
DUAL 2-INPUT POSITIVE-OR GATE  
www.ti.com  
SCES478CAUGUST 2003REVISED JANUARY 2007  
FEATURES  
Available in the Texas Instruments  
NanoFree™ Package  
Low Power Consumption, 10 µA at 1.8 V  
±8-mA Output Drive at 1.8 V  
Optimized for 1.8-V Operation and is 3.6-V I/O  
Tolerant to Support Mixed-Mode Signal  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
Ioff Supports Partial-Power-Down Mode  
Operation  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Sub-1-V Operable  
1000-V Charged-Device Model (C101)  
Max tpd of 1.5 ns at 1.8 V  
YZP PACKAGE  
(BOTTOM VIEW)  
DCT PACKAGE  
(TOP VIEW)  
DCU PACKAGE  
(TOP VIEW)  
4 5  
GND  
2Y  
2A  
2B  
VCC  
1Y  
2B  
2A  
1
2
3
4
8
7
6
5
1A  
1B  
VCC  
1Y  
2B  
2A  
1
2
3
4
8
7
6
5
1A  
1B  
3 6  
2 7  
1 8  
1B  
1Y  
2Y  
VCC  
1A  
GND  
2Y  
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This dual 2-input positive-OR gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to  
1.95-V VCC operation.  
The SN74AUC2G32 performs the Boolean function Y = A + B or Y = A × B in positive logic.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
For more information about AUC Little Logic devices, please refer to the TI application report, Applications of  
Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
NanoFree – WCSP (DSBGA)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
0.23-mm Large Bump – YZP  
(Pb-free)  
Reel of 3000  
SN74AUC2G32YZPR  
_ _ _UG_  
–40°C to 85°C  
SSOP – DCT  
Reel of 3000  
Reel of 3000  
SN74AUC2G32DCTR  
SN74AUC2G32DCUR  
U32_ _ _  
U32_  
VSSOP – DCU  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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