Datasheet > 晶体管 > 小信号双极晶体管> SMBT3906DW3T1G

SMBT3906DW3T1G

更新时间： 2024-11-27 11:01:35

品牌	Logo	应用领域
安森美 - ONSEMI		小信号双极晶体管
页数	文件大小	规格书
6页	104K
描述
Dual PNP Bipolar Transistor

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SMBT3906DW3T1G 数据手册

MBT3906DW1T1

Dual General Purpose

Transistor

The MBT3906DW1T1 device is a spin−off of our popular

SOT−23/SOT−323 three−leaded device. It is designed for general

purpose amplifier applications and is housed in the SOT−363

six−leaded surface mount package. By putting two discrete devices in

one package, this device is ideal for low−power surface mount

applications where board space is at a premium.

http://onsemi.com

(3)

(2)

(1)

Features

• h , 100−300

• Low V , ≤ 0.4 V

CE(sat)

• Simplifies Circuit Design

• Reduces Board Space

(4)

(5)

(6)

• Reduces Component Count

• Available in 8 mm, 7−inch/3,000 Unit Tape and Reel

• Pb−Free Package is Available

MAXIMUM RATINGS

SOT−363/SC−88

CASE 419B

STYLE 1

Rating

Symbol

Value

−40

Unit

Vdc

mAdc

Collector−Emitter Voltage

Collector−Base Voltage

Emitter−Base Voltage

CEO

−40

CBO

EBO

−5.0

−200

MARKING DIAGRAM

Collector Current − Continuous

Electrostatic Discharge

ESD

HBM>16000,

MM>2000

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

THERMAL CHARACTERISTICS

A2 = Device Code

Characteristic

Symbol

Max

Unit

= Date Code

Total Package Dissipation (Note 1)

150

T = 25°C

ORDERING INFORMATION

Thermal Resistance,

Junction−to−Ambient

833

°C/W

°C

†

Device

MBT3906DW1T1

Package

Shipping

SOT−363

3000 Units/Reel

Junction and Storage

Temperature Range

T , T

−55 to +150

stg

MBT3906DW1T1G SOT−363

(Pb−Free)

1. Device mounted on FR4 glass epoxy printed circuit board using the minimum

recommended footprint.

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Semiconductor Components Industries, LLC, 2005

Publication Order Number:

January, 2005 − Rev. 1

MBT3906DW1T1/D

12 3 4 5 6

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与SMBT3906DW3T1G相关器件

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