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SIR402DP-T1-GE3 PDF预览

SIR402DP-T1-GE3

更新时间: 2024-02-29 04:38:28
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 494K
描述
N-Channel 30-V (D-S) MOSFET

SIR402DP-T1-GE3 数据手册

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SiR402DP  
Vishay Siliconix  
N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a  
35  
Definition  
TrenchFET® Power MOSFET  
100 % Rg Tested  
100 % UIS Tested  
0.006 at VGS = 10 V  
0.008 at VGS = 4.5 V  
30  
12 nC  
35  
Compliant to RoHS Directive 2002/95/EC  
PowerPAK SO-8  
APPLICATIONS  
Synchronous Rectification  
DC/DC Point-of-Load  
Server  
S
6.15 mm  
5.15 mm  
1
D
S
2
S
3
G
4
D
8
D
G
7
D
6
D
5
Bottom View  
S
Ordering Information:  
SiR402DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
Symbol  
VDS  
VGS  
Limit  
30  
Unit  
V
20  
35a  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
35a  
Continuous Drain Current (TJ = 150 °C)  
ID  
20.7b, c  
16.6b, c  
70  
A
Pulsed Drain Current  
Avalanche Current  
Avalanche Energy  
IDM  
IAS  
EAS  
35  
61  
30  
3.5b, c  
36  
L = 0.1 mH  
mJ  
A
T
C = 25 °C  
Continuous Source-Drain Diode Current  
IS  
TA = 25 °C  
TC = 25 °C  
T
C = 70 °C  
23  
Maximum Power Dissipation  
PD  
W
4.2b, c  
2.7b, c  
- 55 to 150  
260  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
RthJC  
Typical  
25  
Maximum  
Unit  
t 10 s  
Steady State  
30  
°C/W  
2.9  
3.5  
Notes:  
a. Based on TC = 25 °C. Package limited.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 70 °C/W.  
Document Number: 68683  
S09-1087-Rev. C, 15-Jun-09  
www.vishay.com  
1

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