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SIR438DP-T1-GE3 PDF预览

SIR438DP-T1-GE3

更新时间: 2024-11-18 20:07:39
品牌 Logo 应用领域
威世 - VISHAY 脉冲晶体管
页数 文件大小 规格书
13页 345K
描述
MOSFET N-CH D-S 25V PPAK 8SOIC

SIR438DP-T1-GE3 技术参数

是否无铅: 不含铅生命周期:Not Recommended
零件包装代码:SOT包装说明:SMALL OUTLINE, R-XDSO-C5
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:7.76
雪崩能效等级(Eas):125 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:25 V
最大漏极电流 (Abs) (ID):60 A最大漏极电流 (ID):40 A
最大漏源导通电阻:0.0023 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XDSO-C5JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:5工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):83 W最大脉冲漏极电流 (IDM):80 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:40晶体管元件材料:SILICON
Base Number Matches:1

SIR438DP-T1-GE3 数据手册

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New Product  
SiR438DP  
Vishay Siliconix  
N-Channel 25-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
TrenchFET® Gen III Power MOSFET  
100 % Rg Tested  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a, g  
0.0018 at VGS = 10 V  
0.0023 at VGS = 4.5 V  
60  
60  
25  
32.6 nC  
100 % Avalanche Tested  
PowerPAK® SO-8  
APPLICATIONS  
Server  
- Low Side  
S
6.15 mm  
5.15 mm  
1
S
D
2
S
3
G
4
D
8
D
7
D
G
6
D
5
Bottom View  
S
Ordering Information: SiR438DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
25  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
60a, g  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
60  
Continuous Drain Current (TJ = 150 °C)  
ID  
40b, c  
32b, c  
80  
A
IDM  
IS  
Pulsed Drain Current  
60a, g  
4.9b, c  
50  
TC = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
EAS  
mJ  
W
125  
83  
T
C = 70 °C  
A = 25 °C  
53  
PD  
Maximum Power Dissipation  
5.4b, c  
3.4b, c  
T
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Typical  
Maximum  
Unit  
t 10 s  
18  
23  
°C/W  
Steady State  
RthJC  
1.0  
1.5  
Notes:  
a. Based on TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 65 °C/W.  
g. Package Limited.  
Document Number: 69029  
S-83093-Rev. A, 29-Dec-08  
www.vishay.com  
1

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