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SIR464DP PDF预览

SIR464DP

更新时间: 2024-09-28 09:25:03
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 143K
描述
N-Channel 30-V (D-S) MOSFET

SIR464DP 数据手册

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New Product  
SiR464DP  
Vishay Siliconix  
N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a, e  
50  
TrenchFET® Power MOSFET  
RoHS  
0.0031 at VGS = 10 V  
0.0038 at VGS = 4.5 V  
PowerPAK SO-8  
COMPLIANT  
100 % Rg and UIS Tested  
30  
26.5 nC  
50  
APPLICATIONS  
DC/DC Conversion  
- Low-Side Switch  
D
S
Notebook  
Server  
6.15 mm  
5.15 mm  
1
S
2
S
3
G
4
D
8
G
D
7
D
6
D
5
S
Bottom View  
Ordering Information: SiR464DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
Symbol  
VDS  
Limit  
30  
Unit  
V
VGS  
20  
50e  
T
C = 25 °C  
50e  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
29.5b, c  
23.5b, c  
70  
50e  
4.7b, c  
40  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
IAS  
Single Pulse Avalanche Current  
Avalanche Energy  
L = 0.1 mH  
EAS  
mJ  
W
80  
69  
T
C = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
44.4  
PD  
Maximum Power Dissipation  
5.2b, c  
3.3b, c  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)f, g  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJC  
Typical  
19  
Maximum  
Unit  
Maximum Junction-to-Ambientb, d  
Maximum Junction-to-Case (Drain)  
t 10 s  
Steady State  
24  
°C/W  
1.2  
1.8  
Notes:  
a. Based on TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. Maximum under Steady State conditions is 65 °C/W.  
e. Package limited.  
f. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
g. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 68871  
S-82017-Rev. A, 01-Sep-08  
www.vishay.com  
1

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