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SIR440DP-T1-GE3 PDF预览

SIR440DP-T1-GE3

更新时间: 2024-11-18 21:09:39
品牌 Logo 应用领域
威世 - VISHAY 开关脉冲晶体管
页数 文件大小 规格书
13页 315K
描述
Trans MOSFET N-CH 20V 47A 8-Pin PowerPAK SO T/R

SIR440DP-T1-GE3 技术参数

是否无铅: 不含铅生命周期:Active
零件包装代码:SOT包装说明:SMALL OUTLINE, R-XDSO-C5
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.7
雪崩能效等级(Eas):125 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):60 A最大漏极电流 (ID):47 A
最大漏源导通电阻:0.002 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XDSO-C5JESD-609代码:e3
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):104 W
最大脉冲漏极电流 (IDM):100 A认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:YES
端子面层:MATTE TIN端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SIR440DP-T1-GE3 数据手册

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New Product  
SiR440DP  
Vishay Siliconix  
N-Channel 20-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a  
TrenchFET® Gen III Power MOSFET  
RoHS  
0.00155 at VGS = 10 V  
0.002 at VGS = 4.5 V  
60  
60  
COMPLIANT  
100 % Rg Tested  
20  
43.5 nC  
100 % UIS Tested  
PowerPAK® SO-8  
APPLICATIONS  
Fixed Telecom  
High Current dc-to-dc  
OR-ing  
S
6.15 mm  
5.15 mm  
1
D
S
2
S
3
G
4
D
8
D
7
G
D
6
D
5
Bottom View  
Ordering Information: SiR440DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
Symbol  
VDS  
Limit  
20  
Unit  
V
VGS  
20  
60a  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
60a  
Continuous Drain Current (TJ = 150 °C)  
ID  
47b, c  
37b, c  
100  
60a  
5.6b, c  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
50  
EAS  
mJ  
W
125  
104  
66.6  
6.25b, c  
4.0b, c  
TC = 70 °C  
PD  
Maximum Power Dissipation  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
Maximum  
Unit  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
RthJA  
t 10 s  
15  
20  
°C/W  
Steady State  
RthJC  
0.9  
1.2  
Notes:  
a. Package limited.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 54 °C/W.  
Document Number: 68761  
S-81711-Rev. A, 04-Aug-08  
www.vishay.com  
1

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