SiR410DP
Vishay Siliconix
N-Channel 20-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
•
•
•
Halogen-free
VDS (V)
RDS(on) (Ω)
Qg (Typ.)
I
D (A)a
35
TrenchFET® Power MOSFET
100 % Rg Tested
0.0048 at VGS = 10 V
0.0063 at VGS = 4.5 V
20
12.7 nC
• 100 % UIS Tested
35
APPLICATIONS
PowerPAK® SO-8
•
DC/DC Converter
- Notebook
- POL
S
6.15 mm
5.15 mm
D
1
S
2
S
3
G
4
D
8
D
G
7
D
6
D
5
Bottom View
Ordering Information: SiR410DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted
A
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
VDS
VGS
Limit
20
Unit
V
20
35a
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
35a
Continuous Drain Current (TJ = 150 °C)
ID
23b, c
18.6b, c
60
A
Pulsed Drain Current
Avalanche Current
Avalanche Energy
IDM
IAS
EAS
35
61
30
3.5b, c
36
L = 0.1 mH
mJ
A
T
T
C = 25 °C
A = 25 °C
Continuous Source-Drain Diode Current
IS
TC = 25 °C
C = 70 °C
T
23
Maximum Power Dissipation
PD
W
4.2b, c
2.7b, c
- 55 to 150
260
TA = 25 °C
TA = 70 °C
TJ, Tstg
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
Symbol
RthJA
RthJC
Typical
25
Maximum
Unit
t ≤ 10 s
Steady State
30
°C/W
2.9
3.5
Notes:
a. Package Limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 70 °C/W.
Document Number: 68997
S-82586-Rev. A, 27-Oct-08
www.vishay.com
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