SiR403EDP
Vishay Siliconix
www.vishay.com
P-Channel 30 V (D-S) MOSFET
FEATURES
PowerPAK® SO-8 Single
D
• Extended VGS range ( 2ꢀ V) for adaptor
switch applications
D
7
8
D
6
D
ꢀ
• Extremely low RDS(on)
• TrenchFET® power MOSFET
• 100 % Rg and UIS tested
• Typical ESD performance: 4000 V (HBM)
1
S
2
S
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
3
4
G
S
1
Top View
Bottom View
APPLICATIONS
S
PRODUCT SUMMARY
VDS (V)
• Adaptor switch, load switch
• Power management
-30
0.006ꢀ
0.0082
0.011ꢀ
66
RDS(on) max. () at VGS = -10 V
RDS(on) max. () at VGS = -6 V
RDS(on) max. () at VGS = -4.ꢀ V
Qg typ. (nC)
• Notebook computers and
portable battery packs
G
ID (A) a, e
-40
P-Channel MOSFET
D
Configuration
Single
ORDERING INFORMATION
Package
PowerPAK SO-8
Lead (Pb)-free and halogen-free
SiR403EDP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 2ꢀ °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
-30
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
2ꢀ
TC = 2ꢀ °C
TC = 70 °C
TA = 2ꢀ °C
TA = 70 °C
-40 e
-40 e
Continuous drain current (TJ = 1ꢀ0 °C)
ID
-21.9 b, c
-17.ꢀ b, c
-60
A
Pulsed drain current (t = 300 μs)
IDM
IS
TC = 2ꢀ °C
TA = 2ꢀ °C
-40 e
-4.2 b, c
-40
80
ꢀ6.8
36.4
ꢀ b, c
3.2 b, c
-ꢀꢀ to +1ꢀ0
260
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
L = 0.1 mH
mJ
W
TC = 2ꢀ °C
TC = 70 °C
TA = 2ꢀ °C
TA = 70 °C
Maximum power dissipation
PD
Operating junction and storage temperature range
Soldering recommendations (peak temperature) f, g
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b, d
Maximum junction-to-case (drain)
SYMBOL
RthJA
RthJC
TYPICAL
20
MAXIMUM
UNIT
t 10 s
Steady state
2ꢀ
2.2
°C/W
1.7
Notes
a. Based on TC = 2ꢀ °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. Maximum under steady state conditions is 68 °C/W
e. Package limited
f. See solder profile (www.vishay.com/doc?732ꢀ7). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
g. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
S13-0302-Rev. A, 11-Feb-13
Document Number: 66744
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000