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RFD16N03 PDF预览

RFD16N03

更新时间: 2024-11-05 22:43:59
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
7页 134K
描述
16A, 30V, Avalanche Rated N-Channel Logic Level Enhancement-Mode Power MOSFETs

RFD16N03 数据手册

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RFD16N03L,  
S E M I C O N D U C T O R  
RFD16N03LSM  
16A, 30V, Avalanche Rated N-Channel Logic Level  
Enhancement-Mode Power MOSFETs  
December 1995  
Features  
Packaging  
JEDEC TO-251AA  
• 16A, 30V  
SOURCE  
DRAIN  
GATE  
• rDS(ON) = 0.022Ω  
Temperature Compensating PSPICE Model  
DRAIN (FLANGE)  
• Can be Driven Directly from CMOS, NMOS,  
and TTL Circuits  
• Peak Current vs Pulse Width Curve  
• UIS Rating Curve  
JEDEC TO-252AA  
• +175oC Operating Temperature  
DRAIN (FLANGE)  
Description  
GATE  
SOURCE  
The RFD16N03L and RFD16N03LSM are N-channel power  
MOSFETs manufactured using the MegaFET process. This  
process, which uses feature sizes approaching those of  
LSI circuits, gives optimum utilization of silicon, resulting in  
outstanding performance. They were designed for use in  
applications such as switching regulators, switching convert-  
ers, motor drivers and relay drivers. This performance is  
accomplished through a special gate oxide design which  
provides full rated conductance at gate bias in the 3V - 5V  
range, thereby facilitating true on-off power control directly  
from logic level (5V) integrated circuits.  
Symbol  
DRAIN  
GATE  
PACKAGE AVAILABILITY  
PART NUMBER  
RFD16N03L  
RFD16N03LSM  
PACKAGE  
TO-251AA  
TO-252AA  
BRAND  
16N03L  
16N03L  
SOURCE  
NOTE: When ordering, use the entire part number. Add the suffix  
9A, to obtain the TO-252AA variant in tape and reel, e.g.  
RFD16N03LSM9A.  
Formerly developmental type TA49030.  
o
Absolute Maximum Ratings T = +25 C  
C
RFD16N03L,  
RFD16N03LSM  
UNITS  
Drain-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
30  
30  
V
V
V
DSS  
Drain-Gate Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
DGR  
Gate-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
Drain Current  
±10  
GS  
RMS Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
16  
A
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
Refer to Peak Current Curve  
DM  
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .E  
Refer to UIS Curve  
AS  
Power Dissipation  
o
T
= +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
90  
0.606  
W
W/ C  
C
D
o
o
Derate above +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
o
Operating and Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T  
, T  
-55 to +175  
260  
C
STG  
J
o
Soldering Temperature of Leads for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T  
C
L
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper ESD Handling Procedures.  
File Number 4013.1  
Copyright © Harris Corporation 1995  
5-31  

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