NTD24N06L
Power MOSFET
24 Amps, 60 Volts
Logic Level, N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
http://onsemi.com
24 AMPERES, 60 VOLTS
Features
RDS(on) = 0.036 W (Typ)
• Pb−Free Packages are Available
N−Channel
Typical Applications
D
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Rating
Symbol Value
Unit
Vdc
Vdc
Vdc
MARKING DIAGRAMS
& PIN ASSIGNMENTS
Drain−to−Source Voltage
V
60
60
DSS
DGR
Drain−to−Gate Voltage (R = 10 MW)
V
GS
4
Gate−to−Source Voltage
− Continuous
Drain
V
V
"15
"20
GS
GS
− Non−repetitive (t v10 ms)
p
4
DPAK
CASE 369C
(Surface Mount)
STYLE 2
Drain Current
− Continuous @ T = 25°C
I
I
24
10
72
Adc
Apk
A
A
D
D
2
1
− Continuous @ T = 100°C
3
− Single Pulse (t v10 ms)
I
p
DM
2
1
Gate
3
Total Power Dissipation @ T = 25°C
P
62.5
0.42
1.88
1.36
W
W/°C
W
A
D
Drain
Source
Derate above 25°C
Total Power Dissipation @ T = 25°C (Note 1)
Total Power Dissipation @ T = 25°C (Note 2)
A
A
W
4
Operating and Storage Temperature Range
T , T
−55 to
+175
°C
Drain
J
stg
4
DPAK
CASE 369D
(Straight Lead)
STYLE 2
Single Pulse Drain−to−Source Avalanche
E
162
mJ
AS
Energy − Starting T = 25°C
J
(V = 50 Vdc, V = 5.0 Vdc,
DD
GS
L = 1.0 mH, I (pk) = 18 A, V = 60 Vdc)
L
DS
1
2
Thermal Resistance
°C/W
°C
3
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
R
R
R
2.4
80
110
q
JC
JA
JA
q
q
1
2
3
Gate Drain Source
Maximum Lead Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
T
260
L
Y
= Year
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
WW
24N6L
G
= Work Week
= Device Code
= Pb−Free Package
1. When surface mounted to an FR4 board using 0.5 sq. in. pad size.
2. When surface mounted to an FR4 board using minimum recommended pad
size.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
©
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
August, 2005 − Rev. 2
NTD24N06L/D