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NTD25P03LRLG

更新时间: 2024-11-18 02:59:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
9页 160K
描述
Power MOSFET -25 Amp, -30 Volt

NTD25P03LRLG 数据手册

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NTD25P03L  
Power MOSFET  
25 Amp, 30 Volt  
Logic Level PChannel DPAK  
Designed for low voltage, high speed switching applications and to  
withstand high energy in the avalanche and commutation modes. The  
sourcetodrain diode recovery time is comparable to a discrete fast  
recovery diode.  
http://onsemi.com  
V
R
Typ  
I Max  
D
(BR)DSS  
DS(on)  
30 V  
51 mW @ 5.0 V  
25 A  
Features  
PbFree Packages are Available  
PChannel  
D
Typical Applications  
PWM Motor Controls  
Power Supplies  
Converters  
G
Bridge Circuits  
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
Rating  
Symbol  
Value  
Unit  
DraintoSource Voltage  
V
DSS  
30  
V
4
GatetoSource Voltage  
Continuous  
Drain  
V
GSM  
"15  
"20  
V
GS  
NonRepetitive (tp 10 ms)  
V
Vpk  
4
DPAK  
CASE 369C  
STYLE 2  
Drain Current  
Continuous @ T = 25°C  
I
25  
75  
A
Apk  
A
D
2
1
Single Pulse (t 10 ms)  
I
p
DM  
3
Total Power Dissipation @ T = 25°C  
P
75  
W
A
D
2
1
Gate  
3
Drain  
Operating and Storage Temperature Range  
T , T  
J
55 to  
+150  
°C  
stg  
Source  
Single Pulse DraintoSource Avalanche  
E
200  
mJ  
°C/W  
°C  
AS  
4
Energy Starting T = 25°C  
J
Drain  
(V = 25 Vdc, V = 5.0 Vdc,  
DD  
GS  
4
Peak I = 20 Apk, L = 1.0 mH, R = 25 W)  
L
G
DPAK3  
CASE 369D  
STYLE 2  
Thermal Resistance  
JunctiontoCase  
R
R
R
1.65  
67  
120  
q
JC  
JA  
JA  
JunctiontoAmbient (Note 1)  
JunctiontoAmbient (Note 2)  
q
q
1
2
3
Maximum Lead Temperature for Soldering  
Purposes, (1/8 in from case for 10 seconds)  
T
260  
L
1
2
3
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. When surface mounted to an FR4 board using 0.5 sq in pad size.  
2. When surface mounted to an FR4 board using the minimum recommended  
pad size.  
Gate Drain Source  
Y
= Year  
= Work Week  
= Device Code  
= PbFree Package  
WW  
25P03L  
G
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 7 of this data sheet.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
March, 2006 Rev. 3  
NTD25P03L/D  

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