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NTD2955 PDF预览

NTD2955

更新时间: 2024-01-20 21:13:15
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 68K
描述
Power MOSFET

NTD2955 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:ROHS COMPLIANT, CASE 369C-01, DPAK-3
针数:3Reach Compliance Code:unknown
风险等级:5.17Is Samacsys:N
雪崩能效等级(Eas):216 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (ID):12 A最大漏源导通电阻:0.18 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:NOT SPECIFIED
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大脉冲漏极电流 (IDM):36 A认证状态:COMMERCIAL
表面贴装:YES端子面层:MATTE TIN
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTD2955 数据手册

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NTD2955  
Power MOSFET  
−60 V, 12 A, P−Channel DPAK  
This Power MOSFET is designed to withstand high energy in the  
avalanche and commutation modes. Designed for low−voltage, high−  
speed switching applications in power supplies, converters, and power  
motor controls, these devices are particularly well suited for bridge  
circuits where diode speed and commutating safe operating areas are  
critical and offer an additional safety margin against unexpected  
voltage transients.  
http://onsemi.com  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
−60 V  
155 mW @ −10 V, 6 A  
−12 A  
Features  
Avalanche Energy Specified  
P−Channel  
I  
and V  
Specified at Elevated Temperature  
DSS  
DS(on)  
D
Designed for Low−Voltage, High−Speed Switching Applications and  
to Withstand High Energy in the Avalanche and Commutation Modes  
Pb−Free Packages are Available  
G
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
S
Rating  
Symbol  
Value  
Unit  
Drain−to−Source Voltage  
V
DSS  
−60  
Vdc  
MARKING  
DIAGRAMS  
Gate−to−Source Voltage  
− Continuous  
V
± 20  
± 25  
Vdc  
Vpk  
GS  
V
GSM  
− Non−repetitive (t 10 ms)  
p
4
Drain Current  
Drain Current − Continuous @ T = 25°C  
Drain Current − Single Pulse (t 10 ms)  
Drain  
I
−12  
−36  
Adc  
Apk  
D
a
4
I
DM  
p
DPAK  
CASE 369C  
STYLE 2  
Total Power Dissipation @ T = 25°C  
P
55  
W
a
D
2
3
1
Operating and Storage Temperature  
Range  
T , T  
J
55 to  
175  
°C  
stg  
2
1
Gate  
3
Single Pulse Drain−to−Source Avalanche  
E
AS  
216  
mJ  
Drain  
Source  
Energy − Starting T = 25°C  
J
(V = 25 Vdc, V = 10 Vdc, Peak  
DD  
GS  
4
I = 12 Apk, L = 3.0 mH, R = 25 W)  
L
G
Drain  
Thermal Resistance  
− Junction−to−Case  
− Junction−to−Ambient (Note 1)  
− Junction−to−Ambient (Note 2)  
4
R
R
R
2.73  
71.4  
100  
°C/W  
°C  
DPAK−3  
CASE 369D  
STYLE 2  
q
JC  
JA  
JA  
q
q
Maximum Lead Temperature for Soldering  
Purposes, 1/8 in. from case for  
10 seconds  
T
260  
L
1
2
3
1
2
3
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
Gate Drain Source  
NT2955  
A
Y
W
Device Code  
= Assembly Location  
= Year  
1. When surface mounted to an FR4 board using 1 in pad size  
2
(Cu area = 1.127 in ).  
= Work Week  
2. When surface mounted to an FR4 board using the minimum recommended  
2
pad size (Cu area = 0.412 in ).  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
October, 2004 − Rev. 7  
NTD2955/D  
 

NTD2955 替代型号

型号 品牌 替代类型 描述 数据表
NTD2955PT4G ONSEMI

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Power MOSFET −60 V, −12 A, P−Channel DP
NTD2955G ONSEMI

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Power MOSFET
NTD2955T4G ONSEMI

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Power MOSFET

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NTD2955G ROCHESTER

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−60 V, −12 A, P−Channel DPAK