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NTD2955P PDF预览

NTD2955P

更新时间: 2024-02-14 03:52:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 124K
描述
−60 V, −12 A, P−Channel DPAK

NTD2955P 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:ROHS COMPLIANT, CASE 369C-01, DPAK-3
针数:3Reach Compliance Code:unknown
风险等级:5.17Is Samacsys:N
雪崩能效等级(Eas):216 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (ID):12 A最大漏源导通电阻:0.18 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:NOT SPECIFIED
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大脉冲漏极电流 (IDM):36 A认证状态:COMMERCIAL
表面贴装:YES端子面层:MATTE TIN
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTD2955P 数据手册

 浏览型号NTD2955P的Datasheet PDF文件第2页浏览型号NTD2955P的Datasheet PDF文件第3页浏览型号NTD2955P的Datasheet PDF文件第4页浏览型号NTD2955P的Datasheet PDF文件第5页浏览型号NTD2955P的Datasheet PDF文件第6页浏览型号NTD2955P的Datasheet PDF文件第7页 
NTD2955, NTD2955P,  
NVD2955  
Power MOSFET  
60 V, 12 A, PChannel DPAK  
This Power MOSFET is designed to withstand high energy in the  
avalanche and commutation modes. Designed for lowvoltage, high−  
speed switching applications in power supplies, converters, and power  
motor controls. These devices are particularly well suited for bridge  
circuits where diode speed and commutating safe operating areas are  
critical and offer an additional safety margin against unexpected  
voltage transients.  
http://onsemi.com  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
60 V  
155 mW @ 10 V, 6 A  
12 A  
PChannel  
D
Features  
Avalanche Energy Specified  
I  
and V  
Specified at Elevated Temperature  
DSS  
DS(on)  
Designed for LowVoltage, HighSpeed Switching Applications and  
to Withstand High Energy in the Avalanche and Commutation Modes  
NVD Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AECQ101  
Qualified and PPAP Capable  
G
S
MARKING DIAGRAMS  
These Devices are PbFree and are RoHS Compliant  
4
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
4
4
Rating  
Symbol  
Value  
Unit  
2
1
Drain  
Drain  
3
DraintoSource Voltage  
V
DSS  
60  
Vdc  
DPAK  
CASE 369C  
STYLE 2  
GatetoSource Voltage  
Continuous  
V
GSM  
20  
25  
Vdc  
Vpk  
GS  
V
Nonrepetitive (t 10 ms)  
p
Drain Current  
Drain Current Continuous @ T = 25°C  
Drain Current Single Pulse (t 10 ms)  
I
12  
18  
Adc  
Apk  
2
2
D
a
1
Gate  
1
Gate  
3
3
I
Drain  
Drain  
DM  
p
Source  
Source  
Total Power Dissipation @ T = 25°C  
P
55  
W
a
D
4
Operating and Storage Temperature  
Range  
T , T  
55 to  
175  
°C  
J
stg  
4
Drain  
Single Pulse DraintoSource Avalanche  
E
AS  
216  
mJ  
Energy Starting T = 25°C  
J
(V = 25 Vdc, V = 10 Vdc, Peak  
DD  
GS  
I = 12 Apk, L = 3.0 mH, R = 25 W)  
1
L
G
2
3
Thermal Resistance  
R
R
2.73  
71.4  
100  
°C/W  
°C  
JunctiontoCase  
JunctiontoAmbient (Note 1)  
JunctiontoAmbient (Note 2)  
q
JC  
JA  
JA  
DPAK3  
CASE 369D  
STYLE 2  
q
1
2
3
R
q
Gate Drain Source  
Maximum Lead Temperature for Soldering  
Purposes, 1/8 in. from case for  
10 seconds  
T
260  
L
Y
= Year  
WW = Work Week  
= PbFree Package  
G
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
1. When surface mounted to an FR4 board using 1 in pad size  
2
(Cu area = 1.127 in ).  
2. When surface mounted to an FR4 board using the minimum recommended  
2
pad size (Cu area = 0.412 in ).  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
October, 2012 Rev. 12  
NTD2955/D  
 

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