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NTD25P03L1 PDF预览

NTD25P03L1

更新时间: 2024-11-17 22:40:27
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
10页 78K
描述
Power MOSFET

NTD25P03L1 技术参数

是否无铅: 含铅生命周期:Obsolete
包装说明:CASE 369D-01, DPAK-3针数:4
Reach Compliance Code:not_compliantHTS代码:8541.29.00.95
风险等级:5.14Is Samacsys:N
其他特性:LOGIC LEVEL COMPATIBLE雪崩能效等级(Eas):200 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):25 A
最大漏极电流 (ID):25 A最大漏源导通电阻:0.08 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e0湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):75 W
最大脉冲漏极电流 (IDM):75 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:NO
端子面层:Tin/Lead (Sn80Pb20)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTD25P03L1 数据手册

 浏览型号NTD25P03L1的Datasheet PDF文件第2页浏览型号NTD25P03L1的Datasheet PDF文件第3页浏览型号NTD25P03L1的Datasheet PDF文件第4页浏览型号NTD25P03L1的Datasheet PDF文件第5页浏览型号NTD25P03L1的Datasheet PDF文件第6页浏览型号NTD25P03L1的Datasheet PDF文件第7页 
NTD25P03L  
Power MOSFET  
−25 A, −30 V, Logic Level P−Channel  
DPAK  
Designed for low voltage, high speed switching applications and to  
withstand high energy in the avalanche and commutation modes. The  
source−to−drain diode recovery time is comparable to a discrete fast  
recovery diode.  
http://onsemi.com  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
Typical Applications  
−30 V  
51 mW @ 5.0 V  
−25 A  
PWM Motor Controls  
Power Supplies  
Converters  
D
Bridge Circuits  
P−Channel  
Pb−Free Package is Available  
G
4
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
S
Rating  
Symbol  
Value  
Unit  
MARKING DIAGRAMS  
Drain−to−Source Voltage  
V
DSS  
−30  
V
4
Gate−to−Source Voltage  
− Continuous  
− Non−Repetitive (tp 10 ms)  
Drain  
2
1
V
"15  
"20  
V
Vpk  
GS  
3
V
GSM  
DPAK  
CASE 369C  
(Surface Mount)  
Style 2  
Drain Current  
− Continuous @ T = 25°C  
− Single Pulse (t 10 ms)  
I
−25  
−75  
A
Apk  
D
A
I
DM  
p
Total Power Dissipation @ T = 25°C  
P
75  
Watts  
A
D
2
1
Gate  
3
Operating and Storage Temperature  
Range  
T , T  
−55 to  
+150  
°C  
J
stg  
Drain  
4
Source  
4
Single Pulse Drain−to−Source Avalanche  
E
AS  
200  
mJ  
Drain  
Energy − Starting T = 25°C  
J
(V = 25 Vdc, V = 5.0 Vdc,  
DD  
GS  
Peak I = 20 Apk, L = 1.0 mH,  
1
2
3
L
R
= 25 W)  
G
DPAK  
CASE 369D  
(Straight Lead)  
Style 2  
Thermal Resistance  
− Junction−to−Case  
− Junction−to−Ambient (Note 1)  
− Junction−to−Ambient (Note 2)  
°C/W  
°C  
R
R
R
1.65  
67  
120  
q
JC  
JA  
JA  
q
q
1
2
3
25P03L  
Device Code  
Maximum Lead Temperature for Soldering  
Purposes, (1/8from case for 10 s)  
T
260  
L
Gate Drain Source  
Y
= Year  
WW  
= Work Week  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. When surface mounted to an FR4 board using 0.5 sq in pad size.  
2. When surface mounted to an FR4 board using the minimum recommended  
pad size.  
ORDERING INFORMATION  
75 Units/Rail  
75 Units/Rail  
Device  
Package  
Shipping  
NTD25P03L  
DPAK  
DPAK  
(Pb−Free)  
NTD25P03LG  
DPAK  
Straight Lead  
NTD25P03L1  
NTD25P03LT4  
75 Units/Rail  
DPAK  
2500/Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
August, 2004 − Rev. 1  
NTD25P03L/D  
 

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