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NTD24N06L PDF预览

NTD24N06L

更新时间: 2024-01-11 20:06:02
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 82K
描述
Power MOSFET 24 Amps, 60 Volts Logic Level, N−Channel DPAK

NTD24N06L 技术参数

是否无铅: 不含铅生命周期:End Of Life
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:not_compliantHTS代码:8541.29.00.95
风险等级:5.17其他特性:LOGIC LEVEL COMPATIBLE
雪崩能效等级(Eas):162 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):24 A最大漏极电流 (ID):24 A
最大漏源导通电阻:0.045 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):1.36 W
最大脉冲漏极电流 (IDM):72 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTD24N06L 数据手册

 浏览型号NTD24N06L的Datasheet PDF文件第2页浏览型号NTD24N06L的Datasheet PDF文件第3页浏览型号NTD24N06L的Datasheet PDF文件第4页浏览型号NTD24N06L的Datasheet PDF文件第5页浏览型号NTD24N06L的Datasheet PDF文件第6页浏览型号NTD24N06L的Datasheet PDF文件第7页 
NTD24N06L  
Power MOSFET  
24 Amps, 60 Volts  
Logic Level, N−Channel DPAK  
Designed for low voltage, high speed switching applications in  
power supplies, converters and power motor controls and bridge  
circuits.  
http://onsemi.com  
24 AMPERES, 60 VOLTS  
Features  
RDS(on) = 0.036 W (Typ)  
Pb−Free Packages are Available  
N−Channel  
Typical Applications  
D
Power Supplies  
Converters  
Power Motor Controls  
Bridge Circuits  
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol Value  
Unit  
Vdc  
Vdc  
Vdc  
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
Drain−to−Source Voltage  
V
60  
60  
DSS  
DGR  
Drain−to−Gate Voltage (R = 10 MW)  
V
GS  
4
Gate−to−Source Voltage  
− Continuous  
Drain  
V
V
"15  
"20  
GS  
GS  
− Non−repetitive (t v10 ms)  
p
4
DPAK  
CASE 369C  
(Surface Mount)  
STYLE 2  
Drain Current  
− Continuous @ T = 25°C  
I
I
24  
10  
72  
Adc  
Apk  
A
A
D
D
2
1
− Continuous @ T = 100°C  
3
− Single Pulse (t v10 ms)  
I
p
DM  
2
1
Gate  
3
Total Power Dissipation @ T = 25°C  
P
62.5  
0.42  
1.88  
1.36  
W
W/°C  
W
A
D
Drain  
Source  
Derate above 25°C  
Total Power Dissipation @ T = 25°C (Note 1)  
Total Power Dissipation @ T = 25°C (Note 2)  
A
A
W
4
Operating and Storage Temperature Range  
T , T  
55 to  
+175  
°C  
Drain  
J
stg  
4
DPAK  
CASE 369D  
(Straight Lead)  
STYLE 2  
Single Pulse Drain−to−Source Avalanche  
E
162  
mJ  
AS  
Energy − Starting T = 25°C  
J
(V = 50 Vdc, V = 5.0 Vdc,  
DD  
GS  
L = 1.0 mH, I (pk) = 18 A, V = 60 Vdc)  
L
DS  
1
2
Thermal Resistance  
°C/W  
°C  
3
− Junction−to−Case  
− Junction−to−Ambient (Note 1)  
− Junction−to−Ambient (Note 2)  
R
R
R
2.4  
80  
110  
q
JC  
JA  
JA  
q
q
1
2
3
Gate Drain Source  
Maximum Lead Temperature for Soldering  
Purposes, 1/8 in from case for 10 seconds  
T
260  
L
Y
= Year  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
WW  
24N6L  
G
= Work Week  
= Device Code  
= Pb−Free Package  
1. When surface mounted to an FR4 board using 0.5 sq. in. pad size.  
2. When surface mounted to an FR4 board using minimum recommended pad  
size.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
August, 2005 − Rev. 2  
NTD24N06L/D  
 

NTD24N06L 替代型号

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