NTB5411N, NTP5411N
Power MOSFET
80 Amps, 60 Volts
N-Channel D2PAK, TO-220
Features
http://onsemi.com
• Low R
DS(on)
• High Current Capability
• Avalanche Energy Specified
• These are Pb−Free Devices
I
MAX
D
V
R
MAX
DS(ON)
(Note 1)
(BR)DSS
60 V
10 mW @ 10 V
80 A
Applications
• LED Lighting and LED Backlight Drivers
• DC−DC Converters
N−Channel
• DC Motor Drivers
D
• Power Supplies Secondary Side Synchronous Rectification
MAXIMUM RATINGS (T = 25°C Unless otherwise specified)
J
G
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
V
DSS
S
1
Gate−to−Source Voltage − Continuous
Gate−to−Source Voltage − Nonrepetitive
V
$20
$30
V
GS
GS
V
V
4
(T < 10 ms)
P
4
Continuous Drain
Current R
Steady
State
T
= 25°C
= 100°C
= 25°C
I
80
61
A
C
D
q
JC
2
T
C
(Note 1)
3
Power Dissipation
Steady
State
T
C
P
166
W
D
R
(Note 1)
2
q
JC
TO−220AB
CASE 221A
STYLE 5
D PAK
CASE 418B
STYLE 2
Pulsed Drain Current
t = 10 ms
p
I
185
A
DM
1
2
Operating and Storage Temperature Range
T , T
J
−55 to
175
°C
stg
3
MARKING DIAGRAM
& PIN ASSIGNMENT
Source Current (Body Diode)
I
S
75
A
Single Pulse Drain−to−Source Avalanche
E
AS
280
mJ
4
4
Energy − Starting T = 25°C
J
Drain
Drain
(V = 50 V , V = 10 V , I = 75 A,
dc L(pk)
DD
dc
GS
L = 0.1 mH, R = 25 W)
G
Lead Temperature for Soldering
T
260
°C
L
NTB
5411NG
AYWW
Purposes, 1/8″ from Case for 10 Seconds
NTP
5411NG
AYWW
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Max
0.9
43
Unit
2
1
Gate
3
1
Gate
3
Drain
Junction−to−Case (Drain) Steady State
(Note 1)
°C/W
R
Source
q
JC
Source
R
q
JA
2
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 sq in pad size,
Drain
G
A
Y
= Pb−Free Device
= Assembly Location
= Year
WW = Work Week
(Cu Area 1.127 sq in [1 oz] including traces).
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
October, 2009 − Rev. 2
NTB5411N/D