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NTB5405N

更新时间： 2024-02-16 16:59:02
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 109K
描述
Power MOSFET 40 V, 116 A, Single N−Channel, D2PAK

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NTB5405N 数据手册

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NTB5405N  
Power MOSFET  
40 V, 116 A, Single N−Channel, D2PAK  
Features  
• Low R  
DS(on)  
• High Current Capability  
• Low Gate Charge  
http://onsemi.com  
• These are Pb−Free Devices  
I
D
MAX  
V
R
DS(ON)  
TYP  
(Note 1)  
(BR)DSS  
Applications  
40 V  
4.9 mΩ @ 10 V  
116 A  
• Electronic Brake Systems  
• Electronic Power Steering  
• Bridge Circuits  
N−Channel  
D
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value Units  
V
DSS  
40  
20  
V
V
A
G
Gate−to−Source Voltage  
V
GS  
Continuous Drain  
I
D
T
= 25°C  
116  
82  
C
C
Steady  
State  
S
Current − R  
(Note 1)  
ꢀ
JC  
T
= 100°C  
C
Power Dissipation −  
(Note 1)  
Steady  
State  
P
D
150  
W
T
= 25°C  
R
ꢀ
JC  
MARKING  
DIAGRAM  
Pulsed Drain Current  
t = 10 ꢁ s  
p
I
280  
A
DM  
Operating Junction and Storage Temperature  
T ,  
STG  
−55 to  
175  
°C  
J
T
1
2
Source Current (Body Diode) Pulsed  
I
75  
A
S
3
NTB5405NG  
AYWW  
Single Pulse Drain−to Source Avalanche  
EAS  
800  
mJ  
2
D PAK  
Energy − (V = 50 V, V = 10 V, I = 40 A,  
DD  
GS  
PK  
CASE 418B  
STYLE 2  
L = 1 mH, R = 25 ꢂ)  
G
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
260  
°C  
T
L
1
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
NTB5405N = Specific Device Code  
G
A
Y
= Pb−Free Device  
= Assembly Location  
= Year  
THERMAL RESISTANCE RATINGS  
WW  
= Work Week  
Parameter  
Junction−to−Case (Drain) (Note 1)  
Junction−to−Ambient (Note 2)  
Junction−to−Ambient (Note 3)  
Symbol  
Max  
1.0  
Units  
°C/W  
°C/W  
°C/W  
R
θ
JC  
R
R
45  
θ
JA  
ORDERING INFORMATION  
62.5  
θ
JA  
Device  
Package  
Shipping†  
1. Surface mounted on FR4 board using 1 in sq pad size  
(Cu area = 1.127 in sq [1 oz] including traces).  
2
NTB5405NG  
D PAK  
50 Units / Rail  
2. When surface mounted to an FR4 board using 1 inch pad size,  
(Pb−Free)  
2
(Cu Area 1.127 in ).  
2
NTB5405NT4G  
D PAK  
800 / Tape & Reel  
3. When surface mounted to an FR4 board using minimum recommended pad  
(Pb−Free)  
2
size, (Cu Area 0.412 in ).  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
November, 2008 − Rev. 2  
NTB5405N/D  
 
1234567

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