MSB1218A--RT1G
PNP Silicon General
Purpose Amplifier
Transistor
This PNP Silicon Epitaxial Planar Transistor is designed for general
purpose amplifier applications. This device is housed in the
SC--70/SOT--323 package which is designed for low power surface
mount applications.
http://onsemi.com
COLLECTOR
3
Features
High hFE, 210--460
Low VCE(sat), < 0.5 V
These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T = 25C)
A
1
2
BASE
EMITTER
Rating
Collector--Base Voltage
Collector--Emitter Voltage
Emitter--Base Voltage
Symbol
Value
45
Unit
Vdc
V
(BR)CBO
(BR)CEO
(BR)EBO
3
V
V
45
Vdc
1
7.0
Vdc
2
Collector Current -- Continuous
Collector Current -- Peak
THERMAL CHARACTERISTICS
Rating
I
100
200
mAdc
mAdc
C
I
C(P)
SC--70 (SOT--323)
CASE 419
STYLE 4
Symbol
Max
150
Unit
mW
C
Power Dissipation (Note 1)
Junction Temperature
P
D
MARKING DIAGRAM
T
J
150
Storage Temperature Range
T
stg
--55 to +150
C
ELECTRICAL CHARACTERISTICS
Characteristic
BR M G
G
Symbol
Min Max
Unit
1
Collector--Emitter Breakdown Voltage
V
45
45
7.0
--
--
Vdc
(BR)CEO
(BR)CBO
(BR)EBO
(I = 2.0 mAdc, I = 0)
C
B
Collector--Base Breakdown Voltage
(I = 10 mAdc, I = 0)
V
V
--
Vdc
Vdc
mA
BR = Device Code
C
E
M
G
= Date Code*
= Pb--Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
Emitter--Base Breakdown Voltage
(I = 10 mAdc, I = 0)
--
E
E
Collector--Base Cutoff Current
(V = 20 Vdc, I = 0)
I
I
0.1
100
340
0.5
CBO
CEO
CB
E
Collector--Emitter Cutoff Current
(V = 10 Vdc, I = 0)
--
mA
ORDERING INFORMATION
CE
B
†
Device
Package
Shipping
DC Current Gain (Note 2)
(V = 10 Vdc, I = 2.0 mAdc)
h
210
--
--
FE1
MSB1218A--RT1G
SC--70
(Pb--Free)
3000 /Tape & Reel
CE
C
Collector--Emitter Saturation Voltage
(Note 2) (I = 100 mAdc, I = 10 mAdc)
V
Vdc
CE(sat)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
C
B
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a FR--4 glass epoxy printed circuit board using the
minimum recommended footprint.
2. Pulse Test: Pulse Width 300 ms, D.C. 2%.
Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
October, 2010 -- Rev. 7
MSB1218A--RT1/D