NPN SILICON HIGH
FREQUENCY TRANSISTOR
NE662M04
FEATURES
•
•
•
•
HIGH GAIN BANDWIDTH: fT = 25 GHz
LOW NOISE FIGURE: NF = 1.1 dB at 2 GHz
HIGH MAXIMUM STABLE GAIN: 20 dB at f = 2 GHz
NEW LOW PROFILE M04 PACKAGE:
• SOT-343 footprint, with a height of just 0.59 mm
• Flat Lead Style for better RF performance
DESCRIPTION
The NE662M04 is fabricated using NEC's UHS0 25 GHz fT
wafer process. With a typical transition frequency of 25 GHz
the NE662M04 is usable in applications from 100 MHz to 10
GHz. The NE662M04 provides excellent low voltage/low cur-
rent performance.
M04
NEC's new low profile/flat lead style "M04" package is ideal for
today's portable wireless applications. The NE662M04 is an
ideal choice for LNA and oscillator requirements in all mobile
communication systems.
ELECTRICAL CHARACTERISTICS (TA = 25°C)
PART NUMBER
EIAJ1 REGISTERED NUMBER
PACKAGE OUTLINE
NE662M04
2SC5508
M04
SYMBOLS
PARAMETERS AND CONDITIONS
UNITS
MIN
TYP
MAX
ICBO
IEBO
hFE
Collector Cutoff Current at VCB = 5V, IE = 0
Emitter Cutoff Current at VEB = 1 V, IC = 0
Forward Current Gain2 at VCE = 2 V, IC = 5 mA
Gain Bandwidth at VCE = 3 V, IC = 30 mA, f = 2 GHz
nA
nA
200
200
100
50
20
70
25
20
20
17
1.1
fT
GHz
dB
MAG
MSG
|S21E|2
NF
Maximum Available Power Gain4 at VCE = 2 V, IC = 20 mA, f = 2 GHz
Maximum Stable Gain5 at VCE = 2 V, IC = 20 mA, f = 2 GHz
Insertion Power Gain at VCE = 2 V, IC = 20 mA, f = 2 GHz
Noise Figure at VCE = 2 V, IC = 5 mA, f = 2 GHz, ZIN = ZOPT
dB
dB
14
dB
1.5
P1dB
Output Power at 1 dB compression point at
VCE = 2 V, IC = 20 mA, f = 2 GHz
dBm
pF
11
22
IP3
Third Order Intercept Point at VCE = 2 V, IC = 20 mA, f = 2 GHz
Feedback Capacitance3 at VCB = 2 V, IC = 0, f = 1 MHz
Cre
0.18
0.24
Notes:
1. Electronic Industrial Association of Japan.
2. Pulsed measurement, pulse width ≤ 350 µs, duty cycle ≤ 2 %.
3. Capacitance is measured by capacitance meter (automatic balance bridge method) when emitter pin is connected to the guard pin.
S21
S12
(K- (K2 -1) )
4. MAG =
S21
5. MSG =
S12
California Eastern Laboratories