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NE67300

更新时间: 2024-11-14 03:46:43
品牌 Logo 应用领域
日电电子 - NEC 晶体晶体管放大器
页数 文件大小 规格书
7页 101K
描述
LOW NOISE Ku-K BAND GaAs MESFET FOR HI REL APPLICATIONS ONLY

NE67300 技术参数

生命周期:ObsoleteReach Compliance Code:unknown
风险等级:5.84最高频带:KU BAND
JESD-30 代码:X-XUUC-N封装主体材料:UNSPECIFIED
封装形状:UNSPECIFIED封装形式:UNCASED CHIP
最小功率增益 (Gp):10 dB认证状态:Not Qualified
表面贴装:YES端子形式:NO LEAD
端子位置:UPPER晶体管元件材料:GALLIUM ARSENIDE

NE67300 数据手册

 浏览型号NE67300的Datasheet PDF文件第2页浏览型号NE67300的Datasheet PDF文件第3页浏览型号NE67300的Datasheet PDF文件第4页浏览型号NE67300的Datasheet PDF文件第5页浏览型号NE67300的Datasheet PDF文件第6页浏览型号NE67300的Datasheet PDF文件第7页 
LOW NOISE Ku-K BAND  
GaAs MESFET  
FOR HI REL APPLICATIONS ONLY  
NE67300  
NE67383  
NE67383  
FEATURES  
NOISE FIGURE AND  
ASSOCIATED GAIN vs. FREQUENCY  
VDS = 3 V, IDS = 10 mA  
VERY HIGH fMAX: 100 GHz  
20  
16  
5
4
LOW NOISE FIGURE  
0.4 dB at 4 GHz  
0.8 dB at 8 GHz  
1.4 dB at 12 GHz  
1.9 dB at 18 GHz  
3.3 dB at 26 GHz  
G
A
12  
8
3
2
LG = 0.3 µm, WG = 280 µm  
N+ CONTACT LAYER  
(Triple Epitaxial Technology)  
1
0
PROVEN RELIABILITY AND STABILITY  
SPACE QUALIFIED  
NFOPT  
4
0
1
2
4
8
12  
20  
30  
DESCRIPTION  
Frequency, f (GHz)  
The NE673 features a low noise figure and high associated  
gain through K-band by employing a recessed 0.3 micron  
gate and triple epitaxial technology for industrial and space  
applications.  
The device is available as a chip (NE67300). The chip's gate  
and channel are glassivated with a thin layer of Si3N4 for  
mechanical protection only. The NE673 is in a rugged  
hermetically sealed metal/ceramic stripline package selected  
for NFOPT performance at 12.0 GHz.  
NEC's stringent quality assurance and test procedures as-  
sure the highest reliability and performance.  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
PART NUMBER  
EIAJ REGISTERED NUMBER  
NE67300  
00 (CHIP)  
NE67383  
2SK407  
83  
1
PACKAGE OUTLINE  
SYMBOLS  
PARAMETERS AND CONDITIONS  
UNITS MIN TYP MAX MIN TYP MAX  
NFOPT  
GA  
Optimum Noise Figure at VDS = 3 V, IDS = 10 mA, f =12 GHz  
dB  
1.4  
1.6  
1.4  
1.6  
Associated Gain at Optimum Noise Figure at VDS = 3 V,  
IDS = 10 mA, f = 12 GHz  
dB  
8.5  
20  
10  
8.5  
20  
10  
P1dB  
Output Power at 1 dB Compression Point at VDS = 3 V,  
IDS = 30 mA, f = 12 GHz  
dBm  
mA  
V
14.5  
40  
14.5  
40  
IDS  
VP  
Saturated Drain Current at VDS = 3 V, VGS = 0  
Pinch-off Voltage at VDS = 3 V, IDS = 0.1 mA  
Transconductance at VDS = 3 V, IDS = 10 mA  
Gate to Source Leakage Current at VGS = -5 V  
ThermalResistance(Channel-to-Ambient)  
120  
120  
-0.5 -1.1 -3.5 -0.5 -1.1 -3.5  
gM  
mS  
mA  
°C/W  
20  
50  
1
100  
10  
1902  
20  
50  
1
100  
10  
IGS  
RTH (CH-A)  
450  
Notes:  
1. Electronic Industrial Association of Japan.  
2. RTH (Channel to Case) for chips mounted on an infinite heat sink.  
California Eastern Laboratories  

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