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NDT02N60ZT3G

更新时间: 2024-11-17 01:12:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 110K
描述
N-Channel Power MOSFET

NDT02N60ZT3G 数据手册

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NDT02N60Z  
N-Channel Power MOSFET  
600 V, 8.0 W  
Features  
100% Avalanche Tested  
Extremely High dv/dt Capability  
Gate Charge Minimized  
http://onsemi.com  
Zener−protected  
V
R
MAX  
DS(ON)  
(BR)DSS  
These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS  
Compliant  
600 V  
8.0 W @ 10 V  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
N−Channel  
D (2, 4)  
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
600  
30  
Unit  
V
V
DSS  
Gate−to−Source Voltage  
V
GS  
V
Continuous Drain Current R  
I
0.3  
A
q
D
JA  
JA  
Steady State, T = 25°C  
G (1)  
C
Continuous Drain Current R  
I
D
0.21  
2.0  
A
q
Steady State, T = 100°C  
C
S (3)  
Power Dissipation – R  
P
W
q
D
JA  
Steady State, T = 25°C  
C
MARKING  
DIAGRAM  
Pulsed Drain Current  
I
5
A
A
DM  
Continuous Source Current (Body Diode)  
Single Pulse Drain−to−Source Avalanche  
I
S
2.2  
38  
Drain  
4
EAS  
mJ  
Energy (I = 1.4 A)  
D
4
SOT−223  
CASE 318E  
STYLE 3  
AYW  
2N60ZG  
G
Peak Diode Recovery (Note 1)  
dV/dt  
4.5  
V/ns  
°C  
1
2
Maximum Temperature for Soldering Leads  
T
260  
3
L
1
2
3
Operating Junction and Storage Temperature T , T  
−55 to  
+150  
°C  
J
STG  
Gate Drain Source  
A
Y
W
= Assembly Location  
= Year  
= Work Week  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. I < 2.2 A, di/dt 200 A/ms, V BV  
, T = +150°C  
J
2N60Z = Specific Device Code  
S
DD  
DSS  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
THERMAL RESISTANCE  
Parameter  
Symbol  
Value  
Unit  
Junction−to−Ambient Steady State  
R
°C/W  
q
JA  
NDT02N60Z (Note 2)  
NDT02N60Z (Note 3)  
61  
148  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
2. Surface mounted on FR4 board using 1sq. pad size  
(Cu area = 1.127sq. [2 oz] including traces)  
3. Surface−mounted on FR4 board using minimum recommended pad size  
(Cu area = 0.026” sq. [2 oz]).  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
May, 2014 − Rev. 0  
NDT02N60Z/D  
 

NDT02N60ZT3G 替代型号

型号 品牌 替代类型 描述 数据表
STN1HNK60 STMICROELECTRONICS

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