Datasheet > MMBV3700LT1_06

MMBV3700LT1_06

更新时间： 2024-09-20 04:00:39

品牌	Logo	应用领域
安森美 - ONSEMI		二极管高压
页数	文件大小	规格书
4页	59K
描述
High Voltage Silicon Pin Diodes

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MMBV3700LT1_06 数据手册

MMBV3700LT1, MPN3700

High Voltage Silicon Pin

Diodes

These devices are designed primarily for VHF band switching

applications but are also suitable for use in general−purpose switching

circuits. They are supplied in a cost−effective plastic package for

economical, high−volume consumer and industrial requirements.

They are also available in surface mount.

http://onsemi.com

SOT−23

Features

Anode

Cathode

• Long Reverse Recovery Time t = 300 ns (Typ)

• Rugged PIN Structure Coupled with Wirebond Construction for

Optimum Reliability

MARKING

DIAGRAM

• Low Series Resistance @ 100 MHz −

R = 0.7 W (Typ) @ I = 10 mAdc

SOT−23 (TO−236AB)

CASE 318−08

STYLE 8

• Reverse Breakdown Voltage = 200 V (Min)

• Pb−Free Packages are Available

4R M G

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Reverse Voltage

Vdc

4R = Specific Device Code

= Date Code*

Forward Power Dissipation

= Pb−Free Package

(Note: Microdot may be in either location)

@ T = 25°C

MMBV3700LT1

200

2.8

mW/°C

Derate above 25°C

*Date Code orientation and/or overbar may

vary depending upon manufacturing location.

Forward Power Dissipation

@ T = 25°C

MPN3700

280

2.8

mW/°C

Derate above 25°C

TO−92

Junction Temperature

+125

°C

Storage Temperature Range

stg

−55 to +150

Anode

Cathode

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

MARKING

DIAGRAM

MPN

3700

AYWW G

TO−92 (TO−226AC)

CASE 182−06

STYLE 1

MPN

= Device Code

3700

= Specific Device

= Assembly Location

= Year

= Work Week

= Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

Semiconductor Components Industries, LLC, 2006

Publication Order Number:

January, 2006 − Rev. 3

MMBV3700LT1/D

12 3 4

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