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MMBT451 PDF预览

MMBT451

更新时间: 2024-11-20 20:00:31
品牌 Logo 应用领域
美微科 - MCC 光电二极管晶体管
页数 文件大小 规格书
2页 121K
描述
Small Signal Bipolar Transistor, 1A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon, SOT-23, 3 PIN

MMBT451 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:SOT-23包装说明:SMALL OUTLINE, R-PDSO-G3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.92
最大集电极电流 (IC):1 A集电极-发射极最大电压:60 V
配置:SINGLE最小直流电流增益 (hFE):10
JESD-30 代码:R-PDSO-G3JESD-609代码:e0
元件数量:1端子数量:3
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):240
极性/信道类型:NPN认证状态:Not Qualified
表面贴装:YES端子面层:TIN LEAD
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:30晶体管元件材料:SILICON
标称过渡频率 (fT):150 MHzBase Number Matches:1

MMBT451 数据手册

 浏览型号MMBT451的Datasheet PDF文件第2页 
M C C  
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MMBT451  
Features  
NPN Silicon Planar  
High Perfromance  
Transistor  
·
·
·
1.0 Amp continuous current  
Ptot=500mW  
Marking Code: MMBT451=451  
Maximum Ratings*  
Symbol  
VCEO  
VCBO  
VEBO  
ICM  
Rating  
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
Rating  
60  
80  
5.0  
2.0  
1.0  
200  
500  
Unit  
V
V
V
A
SOT-23  
A
D
Peak Pulse Current  
IC  
IB  
Collector Current, Continuous  
Base Current  
A
B
C
mA  
mW  
OC  
OC  
P
Power Dissipation at Tamb=25OC  
Operating Junction Temperature  
Storage Temperature  
tot  
TJ  
TSTG  
-55 to +150  
-55 to +150  
F
E
Electrical Characteristics @ 25OC Unless Otherwise Specified  
H
G
J
Symbol  
Parameter  
Min  
Max  
Units  
K
OFF CHARACTERISTICS  
VCEO(sus)  
V(BR)CBO  
V(BR)EBO  
Collector-Emitter Breakdown Voltage*  
DIMENSIONS  
MM  
(I =10mAdc, IB=0)  
Collector-Base Breakdown Voltage  
60  
80  
5.0  
---  
---  
---  
---  
---  
---  
Vdc  
Vdc  
Vdc  
uAdc  
uAdc  
Vdc  
Vdc  
---  
C
INCHES  
MIN  
DIM  
A
B
C
D
E
MAX  
.120  
.098  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
MIN  
2.80  
2.10  
1.20  
.89  
1.78  
.45  
.013  
.89  
MAX  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
.100  
1.12  
.180  
.51  
NOTE  
.110  
.083  
.047  
.035  
.070  
.018  
.0005  
.035  
.003  
.015  
(I =100ì Adc, IE=0)  
C
Emitter-Base Breakdown Voltage  
(I =100ì Adc, IC=0)  
E
---  
I
Collector Cutoff Current  
(VCB=60Vdc, IE=0.4Vdc)  
CBO  
F
0.1  
0.1  
0.35  
1.1  
G
H
J
IEBO  
Emitter Cutoff Current  
(VEB=4.0Vdc, IC=0)  
.085  
.37  
K
VCE(sat)  
VBE(sat)  
hFE  
Collector-Emitter Saturation Voltage*  
(I =150mAdc, IB=15mAdc)  
C
Suggested Solder  
Pad Layout  
Base-Emitter Saturation Voltage*  
(I =150mAdc, IB=15mAdc)  
C
.031  
.800  
DC Current Gain  
(VCE=10Vdc, IC=150mAdc)  
(VCE=10Vdc, IC=1.0Adc)  
50  
10  
150  
---  
.035  
.900  
fT  
Transition Frequency  
(IC=150mAdc, VCE=10Vdc, f=100MHz )  
Output Capacitance  
(VCB=10Vdc, f=1.0MHz )  
.079  
2.000  
inches  
mm  
150  
---  
---  
15  
MHz  
pF  
C
obo  
* Measured under pulsed conditions. Pulse width=300us. Duty cycle<2%  
.037  
.950  
.037  
.950  
www.mccsemi.com  
Revision: 2  
2003/04/30  

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