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MMBFJ270 PDF预览

MMBFJ270

更新时间: 2024-11-27 11:13:55
品牌 Logo 应用领域
安森美 - ONSEMI 开关光电二极管晶体管
页数 文件大小 规格书
7页 210K
描述
P沟道开关

MMBFJ270 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.21.00.95
Factory Lead Time:42 weeks风险等级:0.59
Is Samacsys:N配置:SINGLE
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:P-CHANNEL功耗环境最大值:0.225 W
认证状态:Not Qualified表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

MMBFJ270 数据手册

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DATA SHEET  
www.onsemi.com  
P-Channel Switch  
MMBFJ270  
G
D
S
SOT23 (TO236)  
CASE 31808  
Description  
This device is designed for low level analog switching sample and  
hold circuits and chopper stabilized amplifiers.  
Sourced from process 88.  
MARKING DIAGRAMS  
Features  
These are PbFree Devices  
61SMG  
G
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
(Note 1)  
A
1
Symbol  
Parameter  
DrainGate Voltage  
Value  
30  
Unit  
V
61S = Specific Device Code  
M
= Date Code  
V
V
DG  
GS  
GF  
G
= PbFree Package  
(Microdot may be in either location)  
GateSource Voltage  
30  
V
I
Forward Gate Current  
50  
mA  
°C  
T , T  
Operating and Storage Junction  
Temperature Range  
55 to 150  
J
STG  
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. These ratings are limiting values above which the serviceability of any  
semiconductor device may be impaired. These are steadystate limits. The  
factory should be consulted on applications involving pulsed or low duty cycle  
operations.  
Device  
Package  
Shipping  
3000 /  
Tape & Reel  
MMBFJ270 SOT23 (TO236)  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Symbol  
Parameter  
Total Device Dissipation  
Derate Above 25_C  
Max  
225  
1.8  
Unit  
mW  
P
D
mW/°C  
°C/W  
R
Thermal Resistance,  
556  
q
JA  
Junction to Ambient (Note 2)  
2. Device mounted on FR4 PCB, 1 inch x 0.85 inch x 0.062 inch.  
© Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
May, 2022 Rev. 2  
MMBFJ270/D  
 

MMBFJ270 替代型号

型号 品牌 替代类型 描述 数据表
SST174-T1-E3 VISHAY

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