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MJL21193_10

更新时间： 2024-11-03 10:55:43
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
6页 123K
描述
Silicon Power Transistors

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MJL21193_10 数据手册

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MJL21193, MJL21194  
Silicon Power Transistors  
The MJL21193 and MJL21194 utilize Perforated Emitter  
technology and are specifically designed for high power audio output,  
disk head positioners and linear applications.  
Features  
http://onsemi.com  
• Total Harmonic Distortion Characterized  
• High DC Current Gain −  
16 AMPERE COMPLEMENTARY  
SILICON POWER  
h
FE  
= 25 Min @ I  
= 8 Adc  
C
• Excellent Gain Linearity  
• High SOA: 2.25 A, 80 V, 1 Second  
• These are Pb−Free Devices*  
TRANSISTORS  
250 VOLTS, 200 WATTS  
MARKING DIAGRAM  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
250  
400  
5
Unit  
Vdc  
Vdc  
Vdc  
Vdc  
Adc  
Collector−Emitter Voltage  
Collector−Base Voltage  
Emitter−Base Voltage  
Collector−Emitter Voltage − 1.5 V  
V
CEO  
V
CBO  
V
EBO  
MJL2119x  
AYYWWG  
V
CEX  
400  
TO−264  
CASE 340G  
STYLE 2  
1
3
Collector Current − Continuous  
I
C
16  
30  
BASE  
EMITTER  
Peak (Note 1)  
2 COLLECTOR  
Base Current − Continuous  
I
B
5
Adc  
Total Power Dissipation @ T = 25_C  
P
200  
1.43  
W
x
A
YY  
WW  
G
= 3 or 4  
= Assembly Location  
= Year  
= Work Week  
= Pb−Free Package  
C
D
Derate above 25_C  
W/_C  
Operating and Storage Junction  
Temperature Range  
T , T  
J
−65 to  
+150  
_C  
stg  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
Thermal Resistance, Junction−to−Case  
R
0.7  
_C/W  
q
JC  
ORDERING INFORMATION  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤2%  
†
Device  
Package  
Shipping  
MJL21193G  
TO−264  
25 Units / Rail  
(Pb−Free)  
MJL21194G  
TO−264  
25 Units / Rail  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
June, 2010 − Rev. 6  
MJL21193/D  
 
123456

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