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MGSF1P02LT3 PDF预览

MGSF1P02LT3

更新时间: 2024-11-24 22:30:11
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体小信号场效应晶体管开关光电二极管
页数 文件大小 规格书
6页 198K
描述
P-CHANNEL ENHANCEMENT-MODE TMOS MOSFET

MGSF1P02LT3 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:SMALL OUTLINE, R-PDSO-G3Reach Compliance Code:unknown
HTS代码:8541.21.00.95风险等级:5.81
Is Samacsys:N配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):0.75 A
最大漏极电流 (ID):0.75 A最大漏源导通电阻:0.35 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-236AB
JESD-30 代码:R-PDSO-G3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):0.225 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

MGSF1P02LT3 数据手册

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Order this document  
by MGSF1P02LT1/D  
SEMICONDUCTOR TECHNICAL DATA  
Motorola Preferred Device  
P–CHANNEL  
ENHANCEMENT–MODE  
TMOS MOSFET  
Part of the GreenLine Portfolio of devices with energy–  
conserving traits.  
These miniature surface mount MOSFETs utilize Motorola’s  
3
High Cell Density, HDTMOS process. Low r  
assures  
DS(on)  
3 DRAIN  
minimal power loss and conserves energy, making this device  
ideal for use in space sensitive power management circuitry.  
Typical applications are dc–dc converters and power manage-  
ment in portable and battery–powered products such as  
computers, printers, PCMCIA cards, cellular and cordless  
telephones.  
1
2
CASE 318–08, Style 21  
SOT–23 (TO–236AB)  
1
GATE  
Low r  
Life  
Provides Higher Efficiency and Extends Battery  
DS(on)  
2 SOURCE  
Miniature SOT–23 Surface Mount Package Saves Board Space  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Drain–to–Source Voltage  
Symbol  
Value  
20  
Unit  
Vdc  
Vdc  
mA  
V
DSS  
Gate–to–Source Voltage — Continuous  
V
GS  
± 20  
Drain Current — Continuous @ T = 25°C  
I
D
750  
2000  
A
Drain Current — Pulsed Drain Current (t 10 µs)  
I
p
DM  
Total Power Dissipation @ T = 25°C  
P
225  
– 55 to 150  
625  
mW  
°C  
A
D
Operating and Storage Temperature Range  
Thermal Resistance — Junction–to–Ambient  
T , T  
J
stg  
R
°C/W  
°C  
θJA  
Maximum Lead Temperature for Soldering Purposes, 1/8from case for 10 seconds  
T
260  
L
ORDERING INFORMATION  
Device  
MGSF1P02LT1  
MGSF1P02LT3  
Reel Size  
Tape Width  
Quantity  
3000  
7″  
8mm embossed tape  
8mm embossed tape  
13″  
10,000  
GreenLine is a trademark of Motorola, Inc.  
HDTMOS is a trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.  
Thermal Clad is a trademark of the Bergquist Company.  
Preferred devices are Motorola recommended choices for future use and best overall value.  
REV 1  
Motorola, Inc. 1996

MGSF1P02LT3 替代型号

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