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MGSF3441X PDF预览

MGSF3441X

更新时间: 2024-11-21 19:51:15
品牌 Logo 应用领域
安森美 - ONSEMI 开关光电二极管晶体管
页数 文件大小 规格书
33页 310K
描述
1500mA, 20V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, PLASTIC, TSOP-6

MGSF3441X 技术参数

生命周期:Obsolete零件包装代码:TSOP
包装说明:SMALL OUTLINE, R-PDSO-G6针数:6
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.21.00.95风险等级:5.68
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (ID):1.5 A最大漏源导通电阻:0.1 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G6
元件数量:1端子数量:6
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:P-CHANNEL认证状态:Not Qualified
表面贴装:YES端子形式:GULL WING
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

MGSF3441X 数据手册

 浏览型号MGSF3441X的Datasheet PDF文件第2页浏览型号MGSF3441X的Datasheet PDF文件第3页浏览型号MGSF3441X的Datasheet PDF文件第4页浏览型号MGSF3441X的Datasheet PDF文件第5页浏览型号MGSF3441X的Datasheet PDF文件第6页浏览型号MGSF3441X的Datasheet PDF文件第7页 
SEMICONDUCTOR TECHNICAL DATA  
Motorola Preferred Device  
P–CHANNEL  
ENHANCEMENT–MODE  
TMOS MOSFET  
r
= 78 m(TYP)  
DS(on)  
Part of the GreenLine Portfolio of devices with energy–  
conserving traits.  
D
D
S
These miniature surface mount MOSFETs utilize Motorola’s  
1 2 5 6  
DRAIN  
High Cell Density, HDTMOS process. Low r  
assures  
DS(on)  
D
D
minimal power loss and conserves energy, making this device  
ideal for use in small power management circuitry. Typical  
applications are dc–dc converters, power management in  
portable and battery–powered products such as computers,  
printers, PCMCIA cards, cellular and cordless telephones.  
G
CASE 318G–02, Style 1  
TSOP 6 PLASTIC  
3
GATE  
Low r  
Provides Higher Efficiency and Extends Battery Life  
DS(on)  
SOURCE  
4
Miniature TSOP 6 Surface Mount Package Saves Board Space  
Visit our Web Site at http://www.mot–sps.com/ospd  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Drain–to–Source Voltage  
Symbol  
Value  
20  
Unit  
Vdc  
Vdc  
A
V
DSS  
Gate–to–Source Voltage — Continuous  
V
GS  
± 8.0  
Drain Current — Continuous @ T = 25°C  
I
D
1.5  
20  
A
Drain Current — Pulsed Drain Current (t 10 µs)  
I
p
DM  
Total Power Dissipation @ T = 25°C  
P
950  
– 55 to 150  
132  
mW  
°C  
A
D
Operating and Storage Temperature Range  
T , T  
J
stg  
Thermal Resistance — Junction–to–Ambient  
R
°C/W  
°C  
θJA  
Maximum Lead Temperature for Soldering Purposes, for 10 seconds  
T
260  
L
ORDERING INFORMATION  
Device  
Reel Size  
Tape Width  
Quantity  
3000  
MGSF3441XT1  
MGSF3441XT3  
7″  
8 mm embossed tape  
8 mm embossed tape  
13″  
10,000  
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.  
Preferred devices are Motorola recommended choices for future use and best overall value.  
REV 2  
Motorola Small–Signal Transistors, FETs and Diodes Device Data  
4–37  

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