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MGSF2N02EL PDF预览

MGSF2N02EL

更新时间: 2024-01-03 17:23:05
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 58K
描述
2.8 Amps, 20 Volts, N−Channel SOT−23

MGSF2N02EL 数据手册

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MGSF2N02EL  
Preferred Device  
Power MOSFET  
2.8 Amps, 20 Volts, N−Channel SOT−23  
These miniature surface mount MOSFETs low R  
assure  
DS(on)  
minimal power loss and conserve energy, making these devices ideal  
for use in space sensitive power management circuitry.  
http://onsemi.com  
Features  
2.8 A, 20 V  
RDS(on) = 85 mW (max)  
Pb−Free Packages are Available  
Low R  
Provides Higher Efficiency and Extends Battery Life  
DS(on)  
Miniature SOT−23 Surface Mount Package Saves Board Space  
I Specified at Elevated Temperature  
N−Channel  
DSS  
D
Applications  
DC−DC Converters  
Power Management in Portable and Battery Powered Products, ie:  
Computers, Printers, PCMCIA Cards, Cellular and Cordless  
Telephones  
G
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
S
J
Rating  
Drain−to−Source Voltage  
Gate−to−Source Voltage − Continuous  
Drain Current  
Symbol  
Value  
20  
Unit  
Vdc  
Vdc  
A
MARKING  
DIAGRAM  
V
DSS  
V
GS  
± 8.0  
3
− Continuous @ T = 25°C  
I
D
2.8  
5.0  
A
SOT−23  
CASE 318  
STYLE 21  
− Single Pulse (t = 10 ms)  
I
p
DM  
NT M  
1
Total Power Dissipation @ T = 25°C  
P
D
1.25  
W
A
2
Operating and Storage Temperature  
Range  
T , T  
− 55 to  
150  
°C  
J
stg  
Thermal Resistance  
Junction−to−Ambient (Note 1)  
Thermal Resistance  
R
°C/W  
NT  
M
= Device Code  
= Date Code  
q
JA  
100  
300  
260  
Junction−to−Ambient (Note 2)  
Maximum Lead Temperature for Soldering  
Purposes, 1/8from case for 10 seconds  
T
L
°C  
PIN ASSIGNMENT  
3
Drain  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
1. 1” Pad, t < 10 sec.  
2. Min pad, steady state.  
1
Gate  
2
Source  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
Preferred devices are recommended choices for future use  
and best overall value.  
This document contains information on a new product. Specifications and information  
herein are subject to change without notice.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
August, 2004 − Rev. 2  
MGSF2N02EL/D  
 

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