MBD110DWT1,
MBD330DWT1,
MBD770DWT1
Preferred Device
Dual Schottky Barrier
Diodes
http://onsemi.com
Application circuit designs are moving toward the consolidation of
device count and into smaller packages. The new SOT−363 package is
a solution which simplifies circuit design, reduces device count, and
reduces board space by putting two discrete devices in one small
six−leaded package. The SOT−363 is ideal for low−power surface
mount applications where board space is at a premium, such as
portable products.
Anode 1
6 Cathode
5 N/C
N/C 2
Cathode 3
4 Anode
Surface Mount Comparisons:
SOT−363
SOT−23
2
Area (mm )
4.6
120
2
7.6
225
1
Max Package P (mW)
Device Count
D
1
Space Savings:
Package
1 ꢀ SOT−23
2 ꢀ SOT−23
SOT−363
40%
70%
SC−88 / SOT−363
CASE 419B
STYLE 6
The MBD110DW, MBD330DW, and MBD770DW devices are
spin−offs of our popular MMBD101LT1, MMBD301LT1, and
MMBD701LT1 SOT−23 devices. They are designed for
high−efficiency UHF and VHF detector applications. Readily
available to many other fast switching RF and digital applications.
MARKING DIAGRAM
Features
6
• Extremely Low Minority Carrier Lifetime
• Very Low Capacitance
xx M G
G
• Low Reverse Leakage
1
• Pb−Free Packages are Available
MAXIMUM RATINGS
xx = Device Code
Refer to Ordering Table,
page 2
Rating
Symbol
Value
Unit
Reverse Voltage
MBD110DWT1
MBD330DWT1
MBD770DWT1
V
7.0
30
70
V
R
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
Forward Power Dissipation T = 25°C
P
T
120
mW
°C
A
F
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Junction Temperature
−55 to +125
−55 to +150
J
Storage Temperature Range
T
stg
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
March, 2007 − Rev. 5
MBD110DWT1/D