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MBD330D PDF预览

MBD330D

更新时间: 2024-11-22 22:30:23
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 二极管
页数 文件大小 规格书
8页 183K
描述
Dual Schottky Barrier Diodes

MBD330D 数据手册

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Order this document  
by MBD110DWT1/D  
SEMICONDUCTOR TECHNICAL DATA  
Application circuit designs are moving toward the consolidation of device count and  
into smaller packages. The new SOT–363 package is a solution which simplifies  
circuit design, reduces device count, and reduces board space by putting two discrete  
devices in one small six–leaded package. The SOT–363 is ideal for low–power  
surface mount applications where board space is at a premium, such as portable  
products.  
Motorola Preferred Devices  
6
5
4
Surface Mount Comparisons:  
1
2
3
SOT–363  
SOT–23  
2
CASE 419B–01, STYLE 6  
SOT–363  
Area (mm )  
4.6  
120  
2
7.6  
225  
1
Max Package P (mW)  
Device Count  
D
Space Savings:  
Package  
1
SOT–23  
40%  
2
SOT–23  
70%  
SOT–363  
The MBD110DW, MBD330DW, and MBD770DW devices are spin–offs of our  
popular MMBD101LT1, MMBD301LT1, and MMBD701LT1 SOT–23 devices. They  
are designed for high–efficiency UHF and VHF detector applications. Readily  
available to many other fast switching RF and digital applications.  
Extremely Low Minority Carrier Lifetime  
Very Low Capacitance  
Low Reverse Leakage  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Reverse Voltage  
MBD110DWT1  
MBD330DWT1  
MBD770DWT1  
V
R
7.0  
30  
70  
Vdc  
Forward Power Dissipation  
P
T
120  
mW  
F
T
A
= 25°C  
Junction Temperature  
55 to +125  
55 to +150  
°C  
°C  
J
Storage Temperature Range  
T
stg  
DEVICE MARKING  
MBD110DWT1 = M4  
MBD330DWT1 = T4  
MBD770DWT1 = H5  
Thermal Clad is a trademark of the Bergquist Company.  
Preferred devices are Motorola recommended choices for future use and best overall value.  
Motorola, Inc. 1996

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