MBD101, MMBD101LT1
Preferred Device
Schottky Barrier Diodes
Designed primarily for UHF mixer applications but suitable also for
use in detector and ultra−fast switching circuits. Supplied in an
inexpensive plastic package for low−cost, high−volume consumer
requirements. Also available in Surface Mount package.
http://onsemi.com
Features
• Low Noise Figure − 6.0 dB Typ @ 1.0 GHz
• Very Low Capacitance − Less Than 1.0 pF
SILICON SCHOTTKY
BARRIER DIODES
• High Forward Conductance − 0.5 V (Typ) @ I = 10 mA
F
• Pb−Free Packages are Available
MARKING
DIAGRAMS
MAXIMUM RATINGS
TO−92 2−Lead
CASE 182
STYLE 1
MBD
101
Rating
Reverse Voltage
Forward Power Dissipation
Symbol
Value
Unit
AYWW G
V
7.0
V
R
1
G
2
2
CATHODE
1
ANODE
P
F
T = 25°C
A
MBD101
280
225
mW
MMBD101LT1
Derate above 25°C
MBD101
MMBD101LT1
2.2
1.8
mW/°C
SOT−23 (TO−236)
CASE 318
Junction Temperature
T
+150
°C
°C
J
3
STYLE 8
Storage Temperature Range
T
stg
−55 to +150
1
4M M G
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
G
2
3
CATHODE
1
ANODE
1
(Pin 2 Not Connected)
A
Y
= Assembly Location
= Year
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol Min Typ Max
Unit
WW = Work Week
4M = Device Code (SOT−23)
Reverse Breakdown Voltage
V
7.0
10
−
V
(BR)R
(I = 10 mA)
R
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
Diode Capacitance
C
V
−
0.88 1.0
pF
D
(V = 0, f = 1.0 MHz,
R
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Note 1, page 2)
Forward Voltage
−
−
0.5
0.6
V
F
ORDERING INFORMATION
(I = 10 mA)
F
†
Device
MBD101
Package
Shipping
Reverse Leakage
I
0.02 0.25
mA
R
(V = 3.0 V)
R
TO−92
5000 Units / Box
5000 Units / Box
MBD101G
TO−92
(Pb−Free)
MMBD101LT1
SOT−23 3000 / Tape & Reel
MMBD101LT1G
SOT−23 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
March, 2007 − Rev. 3
MBD101/D