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M69AB048BD70W8F PDF预览

M69AB048BD70W8F

更新时间: 2024-11-27 10:07:23
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 内存集成电路
页数 文件大小 规格书
64页 652K
描述
2MX16 PSEUDO STATIC RAM, 70ns, UUC, ROHS COMPLIANT, WAFER

M69AB048BD70W8F 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:WAFER
包装说明:ROHS COMPLIANT, WAFERReach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.84最长访问时间:70 ns
其他特性:SYNCHRONOUS BURST MODE ALSO POSSIBLEI/O 类型:COMMON
JESD-30 代码:X-XUUC-N内存密度:33554432 bit
内存集成电路类型:PSEUDO STATIC RAM内存宽度:16
功能数量:1端子数量:71
字数:2097152 words字数代码:2000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-30 °C组织:2MX16
输出特性:3-STATE封装主体材料:UNSPECIFIED
封装代码:DIE封装等效代码:BGA71,8X12,32
封装形状:UNSPECIFIED封装形式:UNCASED CHIP
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.8 V认证状态:Not Qualified
最大待机电流:0.00001 A子类别:Other Memory ICs
最大压摆率:0.03 mA最大供电电压 (Vsup):1.95 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子形式:NO LEAD
端子节距:0.8 mm端子位置:UPPER
处于峰值回流温度下的最长时间:40Base Number Matches:1

M69AB048BD70W8F 数据手册

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M69KB048BD  
M69AB048BD  
32 Mbit (2 Mb x16) 1.8 V supply, burst PSRAMs  
Features  
FBGA  
Asynchronous SRAM interface  
Fast access time: 70 ns  
Asynchronous page read  
– Page size: 8 words  
FBGA71 (ZA)  
7 x 11mm  
– First access within page: 70 ns  
– Subsequent read within page: 20 ns  
Synchronous burst read/write capability  
– Fixed length (8, or 16 words) or  
continuous mode  
– Output delay: 8 ns max  
– Burst read/write mode: fixed length (8 or 16  
words) or continuous  
Low voltage operating condition  
– V = 1.7 to 1.95 V  
CC  
Byte control by UB and LB  
Low power consumption  
– Active current: 30 mA  
– Standby current: 100 µA  
Wafer  
Three power-down modes  
– Deep power-down  
– Partial array refresh of 4 Mbits  
– Partial array refresh of 8 Mbits  
Wide operating temperature  
– –30 to +85°C  
®
ECOPACK FBGA71 package available  
December 2007  
Rev 2  
1/64  
www.st.com  
1

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