品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | 内存集成电路 | |
页数 | 文件大小 | 规格书 |
64页 | 652K | |
描述 | ||
2MX16 PSEUDO STATIC RAM, 70ns, BGA71, 7 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, FBGA-71 |
是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | 7 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, FBGA-71 | 针数: | 71 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.B.2.A |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.84 |
最长访问时间: | 70 ns | 其他特性: | SYNCHRONOUS BURST MODE ALSO POSSIBLE |
JESD-30 代码: | R-XBGA-B71 | 长度: | 11 mm |
内存密度: | 33554432 bit | 内存集成电路类型: | PSEUDO STATIC RAM |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 71 | 字数: | 2097152 words |
字数代码: | 2000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -30 °C |
组织: | 2MX16 | 封装主体材料: | UNSPECIFIED |
封装代码: | TFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 1.95 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 7 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M69KB048BD70ZA8T | STMICROELECTRONICS |
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2MX16 PSEUDO STATIC RAM, 70ns, BGA71, 7 X 11 MM, 0.80 MM PITCH, FBGA-71 | |
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64 Mbit (4M x16) 1.8V Supply, 80MHz Clock Rate, Burst PSRAM | |
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64 Mbit (4Mb x 16), 104MHz Clock Rate, 1.8V Supply, Bare Die, Burst PSRAM | |
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64 Mbit (4Mb x 16), 104MHz Clock Rate, 1.8V Supply, Bare Die, Burst PSRAM | |
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128 Mbit (8Mb x16) 1.8V Supply, Burst PSRAM |