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M69KB048BD70ZA8F PDF预览

M69KB048BD70ZA8F

更新时间: 2024-11-26 21:19:23
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 内存集成电路
页数 文件大小 规格书
64页 652K
描述
2MX16 PSEUDO STATIC RAM, 70ns, BGA71, 7 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, FBGA-71

M69KB048BD70ZA8F 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:7 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, FBGA-71针数:71
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.84
最长访问时间:70 ns其他特性:SYNCHRONOUS BURST MODE ALSO POSSIBLE
JESD-30 代码:R-XBGA-B71长度:11 mm
内存密度:33554432 bit内存集成电路类型:PSEUDO STATIC RAM
内存宽度:16功能数量:1
端子数量:71字数:2097152 words
字数代码:2000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-30 °C
组织:2MX16封装主体材料:UNSPECIFIED
封装代码:TFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):1.95 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40宽度:7 mm
Base Number Matches:1

M69KB048BD70ZA8F 数据手册

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M69KB048BD  
M69AB048BD  
32 Mbit (2 Mb x16) 1.8 V supply, burst PSRAMs  
Features  
FBGA  
Asynchronous SRAM interface  
Fast access time: 70 ns  
Asynchronous page read  
– Page size: 8 words  
FBGA71 (ZA)  
7 x 11mm  
– First access within page: 70 ns  
– Subsequent read within page: 20 ns  
Synchronous burst read/write capability  
– Fixed length (8, or 16 words) or  
continuous mode  
– Output delay: 8 ns max  
– Burst read/write mode: fixed length (8 or 16  
words) or continuous  
Low voltage operating condition  
– V = 1.7 to 1.95 V  
CC  
Byte control by UB and LB  
Low power consumption  
– Active current: 30 mA  
– Standby current: 100 µA  
Wafer  
Three power-down modes  
– Deep power-down  
– Partial array refresh of 4 Mbits  
– Partial array refresh of 8 Mbits  
Wide operating temperature  
– –30 to +85°C  
®
ECOPACK FBGA71 package available  
December 2007  
Rev 2  
1/64  
www.st.com  
1

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