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IRLML5103GPBF PDF预览

IRLML5103GPBF

更新时间: 2024-11-18 12:20:03
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 242K
描述
HEXFET POWER MOSFET

IRLML5103GPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, MICRO-3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.21.00.95
风险等级:5.15其他特性:HIGH RELIABILITY
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):0.76 A最大漏极电流 (ID):0.76 A
最大漏源导通电阻:0.6 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-236ABJESD-30 代码:R-PDSO-G3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):0.54 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRLML5103GPBF 数据手册

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PD - 96165  
IRLML5103GPbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l P-Channel MOSFET  
l SOT-23 Footprint  
D
VDSS = -30V  
l Low Profile (<1.1mm)  
l Available in Tape and Reel  
l Fast Switching  
G
RDS(on) = 0.60Ω  
S
l Lead-Free  
l Halogen-Free  
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
known for, provides the designer with an extremely efficient  
and reliable device for use in a wide variety of applications.  
Micro3™  
A customized leadframe has been incorporated into the  
standard SOT-23 package to produce a HEXFET Power  
MOSFET with the industry's smallest footprint. This  
package, dubbed the Micro3, is ideal for applications  
whereprintedcircuitboardspaceisatapremium. Thelow  
profile (<1.1mm) of the Micro3 allows it to fit easily into  
extremely thin application environments such as portable  
electronics and PCMCIA cards.  
Absolute Maximum Ratings  
Parameter  
Max.  
-0.76  
Units  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current   
-0.61  
A
-4.8  
PD@TA = 25°C  
Power Dissipation  
540  
mW  
mW/°C  
V
Linear Derating Factor  
4.3  
VGS  
Gate-to-Source Voltage  
± 20  
dv/dt  
TJ,TSTG  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
-5.0  
V/ns  
°C  
-55 to + 150  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambient „  
Typ.  
–––  
Max.  
230  
Units  
°C/W  
RθJA  
www.irf.com  
1
07/23/08  

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