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IRLML5203 PDF预览

IRLML5203

更新时间: 2024-11-19 22:23:47
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
9页 137K
描述
Power MOSFET(Vdss=-30V)

IRLML5203 数据手册

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PD - 93967  
PROVISIONAL  
IRLML5203  
HEXFET® Power MOSFET  
VDSS  
-30V  
RDS(on) max (mΩ)  
98@VGS = -10V  
ID  
-3.0A  
l Ultra Low On-Resistance  
P-Channel MOSFET  
l
l Surface Mount  
165@VGS = -4.5V  
-2.6A  
l Available in Tape & Reel  
l Low Gate Charge  
Description  
TheseP-channelMOSFETsfromInternationalRectifier  
utilize advanced processing techniques to achieve the  
extremely low on-resistance per silicon area. This  
benefitprovidesthedesignerwithanextremelyefficient  
device for use in battery and load management  
applications.  
G
S
1
2
3
D
Micro3TM  
A thermally enhanced large pad leadframe has been  
incorporated into the standard SOT-23 package to  
produceaHEXFETPowerMOSFETwiththeindustry's  
smallestfootprint.Thispackage,dubbedtheMicro3TM  
,
is ideal for applications where printed circuit board  
space is at a premium. The low profile (<1.1mm) of  
the Micro3 allows it to fit easily into extremely thin  
applicationenvironmentssuchasportableelectronics  
and PCMCIA cards. The thermal resistance and  
power dissipation are the best available.  
Absolute Maximum Ratings  
Parameter  
Drain- Source Voltage  
Max.  
-30  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA= 70°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current   
-3.0  
-2.4  
-24  
A
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation  
1.25  
0.80  
10  
W
Power Dissipation  
Linear Derating Factor  
mW/°C  
VGS  
Gate-to-Source Voltage  
± 20  
V
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambientƒ  
Max.  
100  
Units  
°C/W  
RθJA  
www.irf.com  
1
8/28/00  

IRLML5203 替代型号

型号 品牌 替代类型 描述 数据表
IRLML5203TRPBF INFINEON

完全替代

HEXFETPower MOSFET

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