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IRLML6302 PDF预览

IRLML6302

更新时间: 2024-11-19 18:09:31
品牌 Logo 应用领域
合科泰 - HOTTECH /
页数 文件大小 规格书
6页 955K
描述
SOT-23

IRLML6302 数据手册

 浏览型号IRLML6302的Datasheet PDF文件第2页浏览型号IRLML6302的Datasheet PDF文件第3页浏览型号IRLML6302的Datasheet PDF文件第4页浏览型号IRLML6302的Datasheet PDF文件第5页浏览型号IRLML6302的Datasheet PDF文件第6页 
IRLML6302  
P-Channel Power MOSFET  
FEATURES  
GenerationV Technology  
Ultra Low On-Resistance  
Low Profile (<1.1mm)  
Fast Switching  
SOT-23  
MECHANICAL DATA  
Case: SOT-23  
Case Material: Molded Plastic. ULflammability  
Classification Rating: 94V-0  
Weight: 0.008 grams (approximate)  
MARKING:1C7A  
Absolute Maximum Ratings  
(TA = 25°C unless otherwise noted)  
Parameter  
Continuous Drain Current, VGS @ -4.5V  
Continuous Drain Current, VGS @ -4.5V  
Max.  
-0.78  
-0.62  
-4.9  
Units  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
A
Pulsed Drain Current  
Power Dissipation  

PD @TA = 25°C  
540  
mW  
mW/˚C  
V
Linear Derating Factor  
4.3  
VGS  
Gate-to-Source Voltage  
± 12  
dv/dt  
-5.0  
V/ns  
°C  
Peak Diode Recovery dv/dt  
‚
TJ, TSTG  
RJA  
Junction and Storage Temperature Range  
Maximum Junction-to-Ambient  
-55 to + 150  
230  
„
°C/W  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
-20 ––– –––  
––– -4.9 ––– mV/°C Reference to 25°C, ID = -1mA  
Conditions  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
V
VGS = 0V, ID = -250µA  
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient  
––– ––– 0.60  
––– ––– 0.90  
-0.70 ––– -1.5  
0.56 ––– –––  
––– ––– -1.0  
––– ––– -25  
––– ––– -100  
––– ––– 100  
––– 2.4 3.6  
––– 0.56 0.84  
––– 1.0 1.5  
VGS = -4.5V, ID = -0.61A  
VGS = -2.7V, ID = -0.31A  
VDS = VGS, ID = -250µA  
VDS = -10V, ID = -0.31A  
VDS = -16V, VGS = 0V  
ƒ
ƒ
RDS(ON)  
Static Drain-to-Source On-Resistance  
VGS(th)  
gfs  
Gate Threshold Voltage  
V
S
Forward Transconductance  
IDSS  
IGSS  
Drain-to-Source Leakage Current  
µA  
nA  
VDS = -16V, VGS = 0V, TJ = 125°C  
VGS = -12V  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
VGS = 12V  
Qg  
ID = -0.61A  
Qgs  
Qgd  
td(on)  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
nC VDS = -16V  
VGS = -4.5V, See Fig. 6 and 9  
ƒ
––– 13  
––– 18  
–––  
–––  
VDD = -10V  
ID = -0.61A  
tr  
ns  
td(off)  
Turn-Off Delay Time  
Fall Time  
––– 22 –––  
––– 22 –––  
––– 97 –––  
RG = 6.2  
tf  
RD = 16 See Fig. 10 ƒ  
VGS = 0V  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
––– 53  
–––  
pF  
VDS = -15V  
Reverse Transfer Capacitance  
––– 28 –––  
ƒ = 1.0MHz, See Fig. 5  
Source-Drain Ratings and Characteristics  
Parameter  
Continuous Source Current  
(Body Diode)  
Min. Typ. Max. Units  
Conditions  
D
IS  
MOSFET symbol  
––– ––– -0.54  
A
showing the  
G
integral reverse  
Pulsed Source Current  
(Body Diode)   
ISM  
––– ––– -4.9  
p-n junction diode.  
S
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse RecoveryCharge  
––– ––– -1.2  
V
TJ = 25°C, IS = -0.61A, VGS = 0V ƒ  
–––  
35  
53  
39  
ns  
TJ = 25°C, IF = -0.61A  
Qrr  
––– 26  
nC di/dt = 100A/µs  
ƒ
Notes: Repetitive rating pulse width limited by max. junction temperature. ( See fig. 11 )  

‚
ƒ
;
ISD -0.61A, di/dt 76A/µs, VDD V  
Pulse width 300µs duty cycle 2%.  
„ Surface mounted on FR-4 board, t 5sec.  
,
(BR)DSS TJ 150°C  
;
1 / 6  
©GUANGDONG HOTTECH INDUSTRIAL CO.,LTD  
E-mail:hkt@heketai.com  

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