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IRLML5203 PDF预览

IRLML5203

更新时间: 2024-11-21 18:09:23
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合科泰 - HOTTECH /
页数 文件大小 规格书
6页 729K
描述
SOT-23

IRLML5203 数据手册

 浏览型号IRLML5203的Datasheet PDF文件第2页浏览型号IRLML5203的Datasheet PDF文件第3页浏览型号IRLML5203的Datasheet PDF文件第4页浏览型号IRLML5203的Datasheet PDF文件第5页浏览型号IRLML5203的Datasheet PDF文件第6页 
IRLML5203  
P-Channel Power MOSFET  
FEATURES  
GenerationV Technology  
Ultra Low On-Resistance  
Low Profile (<1.1mm)  
Fast Switching  
SOT-23  
MECHANICAL DATA  
Case: SOT-23  
Case Material: Molded Plastic. ULflammability  
Classification Rating: 94V-0  
Weight: 0.008 grams (approximate)  
Absolute Maximum Ratings (TA = 25°C unless otherwise noted)  
Parameter  
Drain- Source Voltage  
Max.  
-30  
Units  
VDS  
V
ID @ TA = 25°C  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
-3.0  
ID @ TA= 70°C  
IDM  
-2.4  
A
Pulsed Drain Current  
Power Dissipation  
Power Dissipation  
-24  

PD @TA = 25°C  
PD @TA = 70°C  
1.25  
W
0.80  
Linear Derating Factor  
10  
mW/°C  
VGS  
Gate-to-Source Voltage  
± 20  
V
Junction and Storage Temperature Range  
-55 to + 150  
°C  
TJ, TSTG  
RJA  
Maximum Junction-to-Ambient  
100  
°C/W  
ƒ
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
Conditions  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
TJ Breakdown Voltage Temp. Coefficient  
-30 ––– –––  
V
VGS = 0V, ID = -250µA  
V(BR)DSS  
/
––– 0.019 ––– V/°C Reference to 25°C, ID = -1mA  
––– –––  
98  
VGS = -10V, I = -3.0A  
D
‚
RDS(on)  
Static Drain-to-Source On-Resistance  
m  
––– ––– 165  
-1.0 ––– -2.5  
3.1 ––– –––  
––– ––– -1.0  
––– ––– -5.0  
––– ––– -100  
––– ––– 100  
VGS = -4.5V, ID = -2.6A  
VDS = VGS, ID = -250µA  
VDS = -10V, ID = -3.0A  
VDS = -24V, VGS = 0V  
‚
VGS(th)  
gfs  
Gate Threshold Voltage  
V
S
Forward Transconductance  
IDSS  
IGSS  
Drain-to-Source Leakage Current  
µA  
nA  
VDS = -24V, VGS = 0V, TJ = 70°C  
VGS = -20V  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
VGS = 20V  
Qg  
––– 9.5  
14  
ID = -3.0A  
Qgs  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
––– 2.3 3.5  
––– 1.6 2.4  
––– 12 –––  
––– 18 –––  
––– 88 –––  
––– 52 –––  
––– 510 –––  
––– 71 –––  
––– 43 –––  
nC VDS = -24V  
VGS = -10V  
Qgd  
‚
‚
td(on)  
VDD = -15V  
tr  
ID = -1.0A  
ns  
td(off)  
Turn-Off Delay Time  
Fall Time  
RG = 6.0  
tf  
VGS = -10V  
VGS = 0V  
Ciss  
Coss  
Input Capacitance  
Output Capacitance  
pF  
VDS = -25V  
ƒ = 1.0MHz  
Crss  
Reverse Transfer Capacitance  
Source-Drain Ratings and Characteristics  
Parameter  
Continuous Source Current  
(Body Diode)  
Min. Typ. Max. Units  
Conditions  
D
IS  
MOSFET symbol  
–––  
–––  
––– -1.3  
showing the  
A
G
integral reverse  
ISM  
Pulsed Source Current  
-24  
–––  
(Body Diode)  

p-n junction diode.  
S
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
––– ––– -1.2  
V
TJ = 25°C, IS = -1.3A, VGS = 0V  
TJ = 25°C, IF = -1.3A  
‚
––– 17  
––– 12  
26  
18  
ns  
Qrr  
nC di/dt = -100A/µs  
‚
Notes:  
Repetitive rating; pulse width limited by max. junction temperature.  
   
Pulse width 400µs; duty cycle 2%.  
Surface mounted on FR-4 board, t 5sec.  

‚
ƒ
1 / 6  
©GUANGDONG HOTTECH INDUSTRIAL CO.,LTD  
E-mail:hkt@heketai.com  

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