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IRHY63C30CM PDF预览

IRHY63C30CM

更新时间: 2024-11-21 03:12:43
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 197K
描述
RADIATION HARDENED POWER MOSFET THRU-HOLE (TO-257AA)

IRHY63C30CM 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:FLANGE MOUNT, R-XSFM-P3Reach Compliance Code:compliant
风险等级:5.38其他特性:HIGH RELIABILITY
雪崩能效等级(Eas):97 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:600 V
最大漏极电流 (Abs) (ID):3.4 A最大漏极电流 (ID):3.4 A
最大漏源导通电阻:3.1 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-257AAJESD-30 代码:R-XSFM-P3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):75 W
最大脉冲漏极电流 (IDM):13.6 A认证状态:Not Qualified
参考标准:RH - 300K Rad(Si)子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
端子形式:PIN/PEG端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICON最大关闭时间(toff):61 ns
最大开启时间(吨):42 nsBase Number Matches:1

IRHY63C30CM 数据手册

 浏览型号IRHY63C30CM的Datasheet PDF文件第2页浏览型号IRHY63C30CM的Datasheet PDF文件第3页浏览型号IRHY63C30CM的Datasheet PDF文件第4页浏览型号IRHY63C30CM的Datasheet PDF文件第5页浏览型号IRHY63C30CM的Datasheet PDF文件第6页浏览型号IRHY63C30CM的Datasheet PDF文件第7页 
PD-95837  
RADIATION HARDENED  
POWER MOSFET  
THRU-HOLE (TO-257AA)  
IRHY67C30CM  
600V, N-CHANNEL  
TECHNOLOGY  
Product Summary  
Part Number  
Radiation Level RDS(on)  
ID  
IRHY67C30CM 100K Rads (Si)  
IRHY63C30CM 300K Rads (Si)  
3.0Ω  
3.0Ω  
3.4A  
3.4A  
International Rectifier’s R6TM technology provides  
superior power MOSFETs for space applications.  
These devices have improved immunity to Single  
Event Effect (SEE) and have been characterized for  
useful performance with Linear Energy Transfer  
(LET) up to 90MeV/(mg/cm2).  
TO-257AA  
Features:  
n
n
n
n
n
n
n
n
n
n
Low RDS(on)  
Fast Switching  
Single Event Effect (SEE) Hardened  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Eyelets  
Their combination of very low R  
and faster  
DS(on)  
switching times reduces power loss and increases  
power density in today’s high speed switching  
applications such as DC-DC converters and motor  
controllers. These devices retain all of the well  
established advantages of MOSFETs such as voltage  
control, ease of paralleling and temperature stability  
of electrical parameters.  
Electrically Isolated  
Light Weight  
Pre-Irradiation  
Absolute Maximum Ratings  
Parameter  
Units  
I
@ V  
= 12V, T = 25°C Continuous Drain Current  
3.4  
2.1  
D
D
GS  
GS  
C
A
I
@ V  
= 12V, T = 100°C Continuous Drain Current  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
13.6  
75  
DM  
@ T = 25°C  
P
D
W
W/°C  
V
C
0.6  
V
±20  
GS  
E
Single Pulse Avalanche Energy Á  
Avalanche Current À  
97  
mJ  
A
AS  
I
3.4  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
7.5  
mJ  
V/ns  
AR  
dv/dt  
8.1  
T
-55 to 150  
J
oC  
g
T
Storage Temperature Range  
STG  
Lead Temperature  
Weight  
300 (0.063 in. /1.6 mm from case for 10s)  
4.3 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
08/14/06  

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