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IRHQ4214 PDF预览

IRHQ4214

更新时间: 2024-11-20 03:36:55
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管开关脉冲
页数 文件大小 规格书
8页 128K
描述
RADIATION HARDENED POWER MOSFET SURFACE MOUNT (LCC-28)

IRHQ4214 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:HERMETIC SEALED, CERAMIC, LCC-28Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.84
其他特性:HIGH RELIABILITY雪崩能效等级(Eas):62 mJ
配置:SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:250 V
最大漏极电流 (ID):1.6 A最大漏源导通电阻:2.25 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-CQCC-N28
元件数量:4端子数量:28
工作模式:ENHANCEMENT MODE封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):6.4 A认证状态:Not Qualified
表面贴装:YES端子形式:NO LEAD
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRHQ4214 数据手册

 浏览型号IRHQ4214的Datasheet PDF文件第2页浏览型号IRHQ4214的Datasheet PDF文件第3页浏览型号IRHQ4214的Datasheet PDF文件第4页浏览型号IRHQ4214的Datasheet PDF文件第5页浏览型号IRHQ4214的Datasheet PDF文件第6页浏览型号IRHQ4214的Datasheet PDF文件第7页 
PD - 93828A  
IRHQ7214  
250V, QUAD N-CHANNEL  
RAD-HardHEXFET®  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (LCC-28)  
MOSFET TECHNOLOGY  
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
IRHQ7214  
IRHQ3214  
IRHQ4214  
100K Rads (Si)  
300K Rads (Si)  
600K Rads (Si)  
2.25Ω  
2.25Ω  
2.25Ω  
1.6A  
1.6A  
1.6A  
1.6A  
IRHQ8214 1000K Rads (Si) 2.25Ω  
LCC-28  
International Rectifier’s RAD-HardTM HEXFET® MOSFET  
technology provides high performance power MOSFETs  
for space applications. This technology has over a de-  
cade of proven performance and reliability in satellite ap-  
plications. These devices have been characterized for  
bothTotal Dose and Single Event Effects (SEE). The com-  
bination of low RDS(on) and low gate charge reduces the  
power losses in switching applications such as DC to DC  
converters and motor control. These devices retain all of  
the well established advantages of MOSFETs such as  
voltage control, fast switching, ease of paralleling and  
temperature stability of electrical parameters.  
Features:  
n
Single Event Effect (SEE) Hardened  
n
n
n
n
n
n
n
n
n
Low RDS(on)  
Low Total Gate Charge  
Proton Tolerant  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Surface Mount  
Light Weight  
Pre-Irradiation  
Absolute Maximum Ratings ( Per Die)  
Parameter  
Units  
I
@ V  
@ V  
= 12V, T = 25°C  
Continuous Drain Current  
1.6  
D
D
GS  
GS  
C
A
I
= 12V, T = 100°C Continuous Drain Current  
1.0  
6.4  
C
I
Pulsed Drain Current ➀  
Max. Power Dissipation  
DM  
@ T = 25°C  
P
12  
W
W/°C  
V
D
C
Linear Derating Factor  
0.1  
V
Gate-to-Source Voltage  
±20  
GS  
E
Single Pulse Avalanche Energy ➀  
Avalanche Current ➀  
62  
mJ  
A
AS  
I
1.6  
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt ➀  
Operating Junction  
1.2  
mJ  
V/ns  
AR  
dv/dt  
3.5  
T
-55 to 150  
J
oC  
g
T
Storage Temperature Range  
STG  
Pckg. Mounting Surface Temp.  
Weight  
300 (for 5s)  
0.89 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
04/22/03  

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