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IRHLNA77064

更新时间: 2024-11-01 03:36:55
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 200K
描述
RADIATION HARDENED LOGIC LEVEL POWER MOSFET SURFACE MOUNT (SMD-2)

IRHLNA77064 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:HERMETIC SEALED, CERAMIC, SMD-2, 3 PINReach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.39
其他特性:FAST SWITCHING雪崩能效等级(Eas):402 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):56 A
最大漏极电流 (ID):56 A最大漏源导通电阻:0.012 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-CBCC-N3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):250 W最大脉冲漏极电流 (IDM):224 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:TIN LEAD
端子形式:NO LEAD端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRHLNA77064 数据手册

 浏览型号IRHLNA77064的Datasheet PDF文件第2页浏览型号IRHLNA77064的Datasheet PDF文件第3页浏览型号IRHLNA77064的Datasheet PDF文件第4页浏览型号IRHLNA77064的Datasheet PDF文件第5页浏览型号IRHLNA77064的Datasheet PDF文件第6页浏览型号IRHLNA77064的Datasheet PDF文件第7页 
PD-97177A  
RADIATION HARDENED  
IRHLNA77064  
LOGIC LEVEL POWER MOSFET  
SURFACE MOUNT (SMD-2)  
60V, N-CHANNEL  
TECHNOLOGY  
™
Product Summary  
Part Number  
IRHLNA77064  
IRHLNA73064  
Radiation Level RDS(on)  
ID  
56A*  
56A*  
100K Rads (Si)  
300K Rads (Si)  
0.012Ω  
0.012Ω  
SMD-2  
Features:  
International Rectifier’s R7TM Logic Level Power  
MOSFETs provide simple solution to interfacing CMOS  
and TTL control circuits to power devices in space and  
other radiation environments. The threshold voltage  
remains within acceptable operating limits over the  
full operating temperature and post radiation. This is  
achieved while maintaining single event gate rupture  
and single event burnout immunity.  
n
n
n
n
n
n
n
n
n
n
5V CMOS and TTL Compatible  
Fast Switching  
Single Event Effect (SEE) Hardened  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Surface Mount  
These devices are used in applications such as current  
boost low signal source in PWM, voltage comparator  
and operational amplifiers.  
Light Weight  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@V  
@V  
= 4.5V,T = 25°C  
Continuous Drain Current  
56*  
56*  
D
D
GS  
GS  
C
A
I
= 4.5V,T = 100°C Continuous Drain Current  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
224  
DM  
@ T = 25°C  
P
D
250  
W
W/°C  
V
C
2.0  
V
±10  
GS  
E
402  
mJ  
A
AS  
I
56  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
25  
mJ  
V/ns  
AR  
dv/dt  
6.9  
T
-55 to 150  
J
°
T
Storage Temperature Range  
Pckg. Mounting Surface Temp.  
Weight  
C
STG  
300 (for 5s)  
3.3 (Typical)  
g
* Current is limited by package  
For footnotes refer to the last page  
www.irf.com  
1
04/06/07  

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