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IRHLNM73110 PDF预览

IRHLNM73110

更新时间: 2024-11-01 20:01:27
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
10页 209K
描述
Power Field-Effect Transistor, 6.5A I(D), 100V, 0.29ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, CERAMIC, SMD-0.2, 3 PIN

IRHLNM73110 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:CHIP CARRIER, R-CBCC-N3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.32
其他特性:HIGH RELIABILITY雪崩能效等级(Eas):21 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):6.5 A
最大漏极电流 (ID):6.5 A最大漏源导通电阻:0.29 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-CBCC-N3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):23.2 W最大脉冲漏极电流 (IDM):26 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:NO LEAD端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRHLNM73110 数据手册

 浏览型号IRHLNM73110的Datasheet PDF文件第2页浏览型号IRHLNM73110的Datasheet PDF文件第3页浏览型号IRHLNM73110的Datasheet PDF文件第4页浏览型号IRHLNM73110的Datasheet PDF文件第5页浏览型号IRHLNM73110的Datasheet PDF文件第6页浏览型号IRHLNM73110的Datasheet PDF文件第7页 
PD-97326C  
2N7609U8  
RADIATION HARDENED  
IRHLNM77110  
LOGIC LEVEL POWER MOSFET  
SURFACE MOUNT (SMD-0.2)  
100V, N-CHANNEL  
TECHNOLOGY  
™
Product Summary  
Part Number  
IRHLNM77110  
IRHLNM73110  
Radiation Level RDS(on)  
ID  
6.5A  
6.5A  
100K Rads (Si)  
300K Rads (Si)  
0.29Ω  
0.29Ω  
Refer to Page 10 for 2 Additional Part Numbers -  
IRHLNMC77110 and IRHLNMC73110 (Ceramic Lid)  
SMD-0.2  
(METAL LID)  
International Rectifier’s R7TM Logic Level Power MOSFETs  
provide simple solution to interfacing CMOS and TTL control  
circuits to power devices in space and other radiation  
environments.The threshold voltage remains within  
Features:  
n
5V CMOS and TTL Compatible  
n
Fast Switching  
acceptable operating limits over the full operating n Single Event Effect (SEE) Hardened  
temperature and post radiation.This is achieved while  
maintaining single event gate rupture and single event  
burnout immunity.  
n
n
n
n
n
n
n
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Surface Mount  
The device is ideal when used to interface directly with most  
logic gates, linear IC’s, micro-controllers, and other device  
types that operate from a 3.3-5V source. It may also be  
used to increase the output current of a PWM, voltage  
Light Weight  
comparator or an operational amplifier where the logic level n ESD Rating: Class 1A per MIL-STD-750,  
drive signal is available.  
Method 1020  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@V  
@V  
= 4.5V,T = 25°C  
Continuous Drain Current  
6.5  
D
GS  
GS  
C
A
I
D
= 4.5V,T = 100°C Continuous Drain Current  
4.1  
26  
C
I
Pulsed Drain Current   
Max. Power Dissipation  
Linear Derating Factor  
DM  
@ T = 25°C  
P
23.2  
0.18  
±10  
W
W/°C  
V
D
C
V
Gate-to-Source Voltage  
GS  
E
Single Pulse Avalanche Energy‚  
Avalanche Current   
21  
mJ  
A
AS  
I
6.5  
AR  
E
Repetitive Avalanche Energy   
Peak Diode Recovery dv/dt ƒ  
Operating Junction  
2.32  
4.3  
mJ  
V/ns  
AR  
dv/dt  
T
-55 to 150  
J
°C  
g
T
Storage Temperature Range  
STG  
Pckg. Mounting Surface Temp.  
Weight  
300 (for 5s)  
0.25 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
02/10/16  

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