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IRHLNM87Y20 PDF预览

IRHLNM87Y20

更新时间: 2024-11-07 01:07:51
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 206K
描述
Simple Drive Requirements

IRHLNM87Y20 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:SMD-0.2, 3 PINReach Compliance Code:unknown
风险等级:5.34其他特性:RADIATION HARDENED
雪崩能效等级(Eas):37 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):17 A最大漏极电流 (ID):17 A
最大漏源导通电阻:0.015 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XBCC-N3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):36 W
最大脉冲漏极电流 (IDM):68 A参考标准:RH - 100K Rad(Si)
子类别:FET General Purpose Power表面贴装:YES
端子形式:NO LEAD端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICON最大关闭时间(toff):50 ns
最大开启时间(吨):174 nsBase Number Matches:1

IRHLNM87Y20 数据手册

 浏览型号IRHLNM87Y20的Datasheet PDF文件第2页浏览型号IRHLNM87Y20的Datasheet PDF文件第3页浏览型号IRHLNM87Y20的Datasheet PDF文件第4页浏览型号IRHLNM87Y20的Datasheet PDF文件第5页浏览型号IRHLNM87Y20的Datasheet PDF文件第6页浏览型号IRHLNM87Y20的Datasheet PDF文件第7页 
PD-97811  
RADIATION HARDENED  
IRHLNM87Y20  
LOGIC LEVEL POWER MOSFET  
SURFACE MOUNT (SMD-0.2)  
20V, N-CHANNEL  
™
TECHNOLOGY  
R8  
Product Summary  
Part Number  
IRHLNM87Y20  
IRHLNM83Y20  
Radiation Level RDS(on)  
ID  
17A*  
17A*  
100K Rads (Si)  
300K Rads (Si)  
15mΩ  
15mΩ  
SMD-0.2  
(METAL LID)  
International Rectifier’s R8TM Logic Level Power MOSFETs  
provide simple solution to interfacing CMOS and TTL control  
circuits to power devices in space and other radiation  
environments.The threshold voltage remains within  
acceptable operating limits over the full operating  
temperature and post radiation.This is achieved while  
maintaining single event gate rupture and single event  
burnout immunity.  
Features:  
n
n
n
n
n
n
n
n
n
n
5V CMOS and TTL Compatible  
Fast Switching  
Single Event Effect (SEE) Hardened  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
The device is ideal when used to interface directly with most  
logic gates, linear IC’s, micro-controllers, and other device  
types that operate from a 3.3-5V source. It may also be  
used to increase the output current of a PWM, voltage  
comparator or an operational amplifier where the logic level  
drive signal is available.  
Hermetically Sealed  
Surface Mount  
Light Weight  
ESD Rating: Class 1B per MIL-STD-750,  
Method 1020  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@V  
@V  
= 4.5V,T = 25°C  
Continuous Drain Current  
17*  
D
D
GS  
GS  
C
A
I
= 4.5V,T = 100°C Continuous Drain Current  
17*  
68  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
DM  
@ T = 25°C  
P
36  
W
W/°C  
V
D
C
0.3  
V
±12  
GS  
E
AS  
37  
mJ  
A
I
17  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
3.6  
mJ  
V/ns  
AR  
dv/dt  
3.75  
-55 to 150  
T
J
°C  
g
T
Storage Temperature Range  
Pckg. Mounting Surface Temp.  
Weight  
STG  
300 (for 5s)  
0.25 (Typical)  
* Current is limited by package  
For footnotes refer to the last page  
www.irf.com  
1
07/09/13  

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