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IRHF597230 PDF预览

IRHF597230

更新时间: 2024-11-18 04:23:11
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 124K
描述
RADIATION HARDENED POWER MOSFET THRU-HOLE (TO-39)

IRHF597230 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:TO-39, 3 PINReach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.32
雪崩能效等级(Eas):157 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (Abs) (ID):4.5 A最大漏极电流 (ID):4.5 A
最大漏源导通电阻:0.54 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-205AFJESD-30 代码:O-CBCY-W3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:ROUND
封装形式:CYLINDRICAL峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):25 W
最大脉冲漏极电流 (IDM):18 A认证状态:Not Qualified
参考标准:RH - 100K Rad(Si)子类别:Other Transistors
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
端子形式:WIRE端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICON最大关闭时间(toff):170 ns
最大开启时间(吨):55 ns

IRHF597230 数据手册

 浏览型号IRHF597230的Datasheet PDF文件第2页浏览型号IRHF597230的Datasheet PDF文件第3页浏览型号IRHF597230的Datasheet PDF文件第4页浏览型号IRHF597230的Datasheet PDF文件第5页浏览型号IRHF597230的Datasheet PDF文件第6页浏览型号IRHF597230的Datasheet PDF文件第7页 
PD - 94450  
RADIATION HARDENED  
POWER MOSFET  
THRU-HOLE (TO-39)  
IRHF597230  
200V, P-CHANNEL  
TECHNOLOGY  
R
5
™
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
IRHF597230  
IRHF593230  
100K Rads (Si) 0.54-4.5A  
300K Rads (Si) 0.54-4.5A  
International Rectifier’s R5TM technology provides  
high performance power MOSFETs for space appli-  
cations. These devices have been characterized for  
Single Event Effects (SEE) with useful performance  
up to an LET of 80 (MeV/(mg/cm2)). The combination  
of low RDS(on) and low gate charge reduces the power  
losses in switching applications such as DC to DC  
converters and motor control. These devices retain  
all of the well established advantages of MOSFETs  
such as voltage control, fast switching, ease of paral-  
leling and temperature stability of electrical param-  
eters.  
T0-39  
Features:  
n
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Ultra Low RDS(on)  
Low Total Gate Charge  
Proton Tolerant  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Light Weight  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@ V  
@ V  
= -12V, T = 25°C Continuous Drain Current  
-4.5  
-3.0  
D
GS  
C
A
I
D
= -12V, T = 100°C Continuous Drain Current  
C
GS  
I
Pulsed Drain Current ➀  
Max. Power Dissipation  
-18  
DM  
@ T = 25°C  
P
25  
W
W/°C  
V
D
C
Linear Derating Factor  
0.2  
V
Gate-to-Source Voltage  
±20  
GS  
E
Single Pulse Avalanche Energy ➀  
Avalanche Current ➀  
157  
mJ  
A
AS  
I
-4.5  
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt ➀  
Operating Junction  
2.5  
mJ  
V/ns  
AR  
dv/dt  
-25  
T
-55 to 150  
J
T
Storage Temperature Range  
oC  
g
STG  
Lead Temperature  
Weight  
300 (0.063in/1.6mm from case for 10s )  
0.98 ( Typical )  
For footnotes refer to the last page  
www.irf.com  
1
06/18/02  

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