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IRG7S319UPBF PDF预览

IRG7S319UPBF

更新时间: 2024-11-01 05:39:31
品牌 Logo 应用领域
英飞凌 - INFINEON 光电二极管双极性晶体管
页数 文件大小 规格书
8页 245K
描述
PDP TRENCH IGBT

IRG7S319UPBF 数据手册

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PD - 97155  
IRG7S319UPbF  
PDP TRENCH IGBT  
Key Parameters  
Features  
VCE min  
330  
1.26  
170  
150  
V
V
l
Advanced Trench IGBT Technology  
l
Optimized for Sustain and Energy Recovery  
circuits in PDP applications  
VCE(ON) typ. @ IC = 20A  
IRP max @ TC= 25°C  
TJ max  
A
TM  
l
Low VCE(on) and Energy per Pulse (EPULSE  
for improved panel efficiency  
)
°C  
l
l
High repetitive peak current capability  
Lead Free package  
C
E
C
G
G
D2Pak  
E
IRG7S319UPbF  
n-channel  
G
C
E
Gate  
Collector  
Emitter  
Description  
This IGBT is specifically designed for applications in Plasma Display Panels. This device utilizes advanced  
trenchIGBTtechnologytoachievelowVCE(on)andlowEPULSETM ratingpersiliconareawhichimprovepanel  
efficiency. Additional features are 150°C operating junction temperature and high repetitive peak current  
capability. These features combine to make this IGBT a highly efficient, robust and reliable device for PDP  
applications.  
Absolute Maximum Ratings  
Max.  
Parameter  
Units  
VGE  
±30  
Gate-to-Emitter Voltage  
V
IC @ TC = 25°C  
IC @ TC = 100°C  
IRP @ TC = 25°C  
PD @TC = 25°C  
PD @TC = 100°C  
Continuous Collector Current, VGE @ 15V  
Continuous Collector, VGE @ 15V  
Repetitive Peak Current  
45  
20  
A
W
170  
96  
Power Dissipation  
38  
Power Dissipation  
0.77  
Linear Derating Factor  
W/°C  
°C  
TJ  
-40 to + 150  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature for 10 seconds  
300  
Thermal Resistance  
Parameter  
Typ.  
Max.  
Units  
RθJC  
Junction-to-Case  
–––  
1.3  
°C/W  
www.irf.com  
1
10/2/09  

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