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IRG7SC12FTRRPBF PDF预览

IRG7SC12FTRRPBF

更新时间: 2024-10-31 20:55:15
品牌 Logo 应用领域
英飞凌 - INFINEON
页数 文件大小 规格书
10页 242K
描述
Insulated Gate Bipolar Transistor, 24A I(C), 600V V(BR)CES, N-Channel

IRG7SC12FTRRPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:,Reach Compliance Code:compliant
风险等级:5.26最大集电极电流 (IC):24 A
集电极-发射极最大电压:600 V最大降落时间(tf):180 ns
门极发射器阈值电压最大值:7 V门极-发射极最大电压:30 V
最高工作温度:150 °C极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):69 W最大上升时间(tr):40 ns
子类别:Insulated Gate BIP Transistors表面贴装:YES
Base Number Matches:1

IRG7SC12FTRRPBF 数据手册

 浏览型号IRG7SC12FTRRPBF的Datasheet PDF文件第2页浏览型号IRG7SC12FTRRPBF的Datasheet PDF文件第3页浏览型号IRG7SC12FTRRPBF的Datasheet PDF文件第4页浏览型号IRG7SC12FTRRPBF的Datasheet PDF文件第5页浏览型号IRG7SC12FTRRPBF的Datasheet PDF文件第6页浏览型号IRG7SC12FTRRPBF的Datasheet PDF文件第7页 
PD - 96363  
IRG7SC12FPbF  
INSULATED GATE BIPOLAR TRANSISTOR  
C
Features  
VCES = 600V  
• Low VCE (ON) Trench IGBT Technology  
• Maximum Junction temperature 150 °C  
• 3 μS short circuit SOA  
IC = 8A, TC = 100°C  
G
• SquareRBSOA  
tSC 3μs, TJ(max) = 150°C  
• Positive VCE (ON) Temperature co-efficient  
• Tightparameterdistribution  
• LeadFreePackage  
E
VCE(on) typ. = 1.60V  
n-channel  
C
Benefits  
E
G
• High Efficiency in a HVAC, Refrigerator applications  
• RuggedtransientPerformanceforincreasedreliability  
• ExcellentCurrentsharinginparalleloperation  
• Low EMI  
D2Pak  
IRG7SC12FPbF  
G
C
E
Gate  
Collector  
Emitter  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VCES  
Collector-to-Emitter Voltage  
Continuous Collector Current  
Continuous Collector Current  
Nominal Current  
600  
V
IC @ TC = 25°C  
IC @ TC = 100°C  
INOMINAL  
24  
13  
A
8
ICM  
Pulse Collector Current  
24  
32  
Clamped Inductive Load Current  
Gate-to-Emitter Voltage  
ILM  
V
± 30  
VGE  
PD @ TC = 25°C  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction and  
69  
W
PD @ TC = 100°C  
28  
TJ  
-55 to +150  
°C  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
300 (0.063 in. (1.6mm) from case)  
Thermal Resistance  
Parameter  
Thermal Resistance Junction-to-Case  
Thermal Resistance, Case-to-Sink (flat, greased surface)  
Thermal Resistance, Junction-to-Ambient (typical socket mount)  
Min.  
–––  
–––  
–––  
Typ.  
–––  
0.50  
40  
Max.  
1.8  
Units  
RθJC  
RθCS  
RθJA  
°C/W  
–––  
–––  
1
www.irf.com  
03/25/11  

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