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IRFR330B PDF预览

IRFR330B

更新时间: 2024-11-25 22:40:59
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
9页 672K
描述
400V N-Channel MOSFET

IRFR330B 数据手册

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November 2001  
IRFR330B / IRFU330B  
400V N-Channel MOSFET  
General Description  
Features  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switch mode power supplies and  
electronic lamp ballasts based on half bridge.  
4.5A, 400V, R  
= 1.0@V = 10 V  
DS(on) GS  
Low gate charge ( typical 25 nC)  
Low Crss ( typical 20 pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
D
!
D
G!  
I-PAK  
IRFU Series  
D-PAK  
IRFR Series  
G
S
G D S  
!
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
IRFR330B / IRFU330B  
Units  
V
V
I
Drain-Source Voltage  
400  
4.5  
DSS  
- Continuous (T = 25°C)  
Drain Current  
A
D
C
- Continuous (T = 100°C)  
2.9  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
18  
A
DM  
V
E
I
Gate-Source Voltage  
± 30  
330  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
4.5  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
4.8  
mJ  
V/ns  
W
AR  
dv/dt  
5.5  
Power Dissipation (T = 25°C) *  
2.5  
P
A
D
Power Dissipation (T = 25°C)  
48  
W
C
- Derate above 25°C  
Operating and Storage Temperature Range  
0.38  
-55 to +150  
W/°C  
°C  
T , T  
J
stg  
Maximum lead temperature for soldering purposes,  
T
300  
°C  
L
1/8" from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
--  
Max  
2.6  
50  
Units  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient *  
Thermal Resistance, Junction-to-Ambient  
θJC  
θJA  
θJA  
--  
--  
110  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2001 Fairchild Semiconductor Corporation  
Rev. B, November 2001  

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