PD - 95750
IRFIB7N50LPbF
SMPS MOSFET
HEXFET® Power MOSFET
Applications
Trr typ.
VDSS RDS(on)
ID
typ.
• Zero Voltage Switching SMPS
• Telecom and Server Power Supplies
• Uninterruptible Power Supplies
• Motor Control applications
• Lead-Free
500V
85ns 6.8A
320mΩ
Features and Benefits
• SuperFast body diode eliminates the need for external
diodes in ZVS applications.
• Lower Gate charge results in simpler drive requirements.
• Enhanced dv/dt capabilities offer improved ruggedness.
• Higher Gate voltage threshold offers improved noise
immunity.
TO-220 Full-Pak
Absolute Maximum Ratings
Parameter
Max.
6.8
4.3
27
Units
A
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V
IDM
Pulsed Drain Current
PD @TC = 25°C
Power Dissipation
46
W
Linear Derating Factor
Gate-to-Source Voltage
0.37
±30
W/°C
V
VGS
dv/dt
TJ
Peak Diode Recovery dv/dt
Operating Junction and
24
V/ns
-55 to + 150
TSTG
Storage Temperature Range
°C
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw
300 (1.6mm from case )
10lb in (1.1N m)
Diode Characteristics
Symbol
Parameter
Continuous Source Current
Min. Typ. Max. Units
––– ––– 6.8
Conditions
MOSFET symbol
D
I
S
(Body Diode)
Pulsed Source Current
A
showing the
integral reverse
G
I
––– –––
27
SM
S
(Body Diode)
p-n junction diode.
V
t
T = 25°C, I = 6.8A, V = 0V
J S GS
Diode Forward Voltage
––– ––– 1.5
––– 85 130
––– 130 200
V
SD
T = 25°C, I = 6.8A
Reverse Recovery Time
Reverse Recovery Charge
ns
rr
J
F
TJ = 125°C, di/dt = 100A/µs
Q
T = 25°C, I = 6.8A, V = 0V
––– 280 420 nC
––– 570 860
rr
J
S
GS
TJ = 125°C, di/dt = 100A/µs
IRRM
T = 25°C
J
Reverse Recovery Current
Forward Turn-On Time
––– 5.9
8.9
A
t
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
on
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1
8/23/04