IRFIBC30G, SiHFIBC30G
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Isolated Package
600
Available
• High Voltage Isolation = 2.5 kVRMS (t = 60 s;
f = 60 Hz)
RDS(on) (Ω)
VGS = 10 V
2.2
RoHS*
COMPLIANT
• Sink to Lead Creepage Distance = 4.8 mm
• Dynamic dV/dt Rating
Qg (Max.) (nC)
31
4.6
Q
Q
gs (nC)
gd (nC)
• Low Thermal Resistance
17
• Lead (Pb)-free Available
Configuration
Single
DESCRIPTION
D
TO-220 FULLPAK
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The TO-220 FULLPAK eliminates the need for additional
insulating hardware in commercial-industrial applications.
The moulding compound used provides a high isolation
capability and a low thermal resistance between the tab and
external heatsink. This isolation is equivalent to using a 100
micron mica barrier with standard TO-220 product. The
FULLPAK is mounted to a heatsink using a single clip or by
a single screw fixing.
G
S
N-Channel MOSFET
S
D
G
ORDERING INFORMATION
Package
TO-220 FULLPAK
IRFIBC30GPbF
SiHFIBC30G-E3
IRFIBC30G
Lead (Pb)-free
SnPb
SiHFIBC30G
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
600
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
20
T
C = 25 °C
2.5
Continuous Drain Current
VGS at 10 V
ID
TC =100°C
1.6
A
Pulsed Drain Currenta
IDM
10
Linear Derating Factor
0.28
250
W/°C
mJ
A
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
EAS
IAR
2.5
EAR
3.5
mJ
W
Maximum Power Dissipation
T
C = 25 °C
PD
35
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
3.0
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 150
300d
10
°C
for 10 s
6-32 or M3 screw
lbf · in
N · m
Mounting Torque
1.1
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 73 mH, RG = 25 Ω, IAS = 2.5 A (see fig. 12).
c. ISD ≤ 3.6 A, dI/dt ≤ 60 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91180
S09-0010-Rev. A, 19-Jan-09
www.vishay.com
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