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IRF3711ZCSTRRP PDF预览

IRF3711ZCSTRRP

更新时间: 2024-11-25 19:57:27
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
11页 269K
描述
Power Field-Effect Transistor, 30A I(D), 20V, 0.006ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, LEAD FREE, PLASTIC, D2PAK-3

IRF3711ZCSTRRP 数据手册

 浏览型号IRF3711ZCSTRRP的Datasheet PDF文件第2页浏览型号IRF3711ZCSTRRP的Datasheet PDF文件第3页浏览型号IRF3711ZCSTRRP的Datasheet PDF文件第4页浏览型号IRF3711ZCSTRRP的Datasheet PDF文件第5页浏览型号IRF3711ZCSTRRP的Datasheet PDF文件第6页浏览型号IRF3711ZCSTRRP的Datasheet PDF文件第7页 
PD - 94792  
IRF3711ZCS  
IRF3711ZCL  
HEXFET® Power MOSFET  
Applications  
l High Frequency Synchronous Buck  
Converters for Computer Processor Power  
VDSS RDS(on) max  
Qg  
6.0m:  
20V  
16nC  
Benefits  
l Low RDS(on) at 4.5V VGS  
l Ultra-Low Gate Impedance  
l Fully Characterized Avalanche Voltage  
and Current  
D2Pak  
TO-262  
IRF3711ZCS  
IRF3711ZCL  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
Drain-to-Source Voltage  
20  
V
V
Gate-to-Source Voltage  
± 20  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
92  
65  
380  
I
I
I
@ TC = 25°C  
A
D
D
@ TC = 100°C  
DM  
P
P
@TC = 25°C  
Maximum Power Dissipation  
Maximum Power Dissipation  
79  
40  
W
D
D
@TC = 100°C  
Linear Derating Factor  
Operating Junction and  
0.53  
W/°C  
°C  
T
-55 to + 175  
J
T
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
300 (1.6mm from case)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
1.89  
40  
Units  
°C/W  
RθJC  
Junction-to-Case  
RθJA  
–––  
Junction-to-Ambient (PCB Mount)  
Notes  through are on page 11  
www.irf.com  
1
10/07/03  

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